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제조업체 |
설명 |
패키지 |
재고 |
수량 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
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Molex, LLC |
CONN FPC VERT 17POS 1.00MM SMD
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패키지: - |
재고7,002 |
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Surface Mount | Contacts, Vertical, 1 Sided | 17 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 14POS 0.50MM R/A
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패키지: - |
재고4,536 |
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Surface Mount, Right Angle | Contacts, Bottom | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.051" (1.30mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 27POS 1.00MM R/A
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패키지: - |
재고6,282 |
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Surface Mount, Right Angle | Contacts, Bottom | 27 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 29POS 1.00MM R/A
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패키지: - |
재고4,644 |
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Surface Mount, Right Angle | Contacts, Top | 29 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 51POS .3MM SMD R/A
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패키지: - |
재고3,312 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 51 | 0.012" (0.30mm) | Solder | 0.20mm | 0.037" (0.95mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 22POS 0.50MM SMD
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패키지: - |
재고3,744 |
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Surface Mount | Contacts, Vertical, 1 Sided | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 15POS 0.5MM R/A
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패키지: - |
재고3,366 |
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Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 30POS 0.50MM SMD
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패키지: - |
재고3,384 |
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Surface Mount | Contacts, Vertical, 1 Sided | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 30POS 0.50MM SMD
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패키지: - |
재고6,012 |
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Surface Mount | Contacts, Vertical, 1 Sided | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 14POS 0.50MM R/A
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패키지: - |
재고8,856 |
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Surface Mount, Right Angle | Contacts, Top | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC VERT 11POS 1.00MM SMD
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패키지: - |
재고6,228 |
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Surface Mount | Contacts, Vertical, 1 Sided | 11 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 15POS 0.50MM R/A
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패키지: - |
재고7,128 |
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Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 15POS 0.50MM R/A
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패키지: - |
재고3,222 |
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Surface Mount, Right Angle | Contacts, Top | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
0.5 FPC BF H=1.0 ASSY 24P
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패키지: - |
재고7,164 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.039" (1.00mm) | Flip Lock, Backlock | Straight, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
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Molex, LLC |
CONN FFC BOTTOM 14POS 0.5MM R/A
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패키지: - |
재고4,392 |
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Surface Mount, Right Angle | Contacts, Bottom | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 28POS 1.00MM R/A
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패키지: - |
재고8,388 |
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Surface Mount, Right Angle | Contacts, Top | 28 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 9POS 0.50MM SMD
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패키지: - |
재고6,660 |
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Surface Mount | Contacts, Vertical, 1 Sided | 9 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Slide Lock | Straight, Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 26POS 1.00MM R/A
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패키지: - |
재고3,474 |
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Surface Mount, Right Angle | Contacts, Bottom | 26 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 20POS 1.25MM R/A
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패키지: - |
재고2,646 |
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Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.049" (1.25mm) | Solder | 0.30mm | 0.110" (2.80mm) | Flip Lock, Backlock | Notched | Copper Alloy | Tin | - | Liquid Crystal Polymer (LCP), Glass Filled | Solder Retention | 300V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 20POS 1.25MM R/A
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패키지: - |
재고6,822 |
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Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.049" (1.25mm) | Solder | 0.30mm | 0.110" (2.80mm) | Flip Lock, Backlock | Notched | Copper Alloy | Tin | - | Liquid Crystal Polymer (LCP), Glass Filled | Solder Retention | 300V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 13POS 0.50MM R/A
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패키지: - |
재고3,454 |
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Surface Mount, Right Angle | Contacts, Top | 13 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 39POS .3MM SMD R/A
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패키지: - |
재고4,464 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 39 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 41POS .3MM SMD R/A
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패키지: - |
재고8,838 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 39 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 15POS 1.25MM R/A
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패키지: - |
재고7,254 |
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Through Hole, Right Angle | Contacts, Top | 15 | 0.049" (1.25mm) | Solder | 0.30mm | 0.197" (5.00mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF E02HSGASSY18CKTEMB
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패키지: - |
재고8,424 |
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Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN CIC FFC RCPT 4POS 2.54MM
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패키지: - |
재고7,542 |
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Free Hanging (In-Line) | Receptacle | 4 | 0.100" (2.54mm) | IDC | 0.13-0.28mm, 0.30mm | - | Latch Lock | Straight | Phosphor Bronze | Gold | Polyester, Glass Filled | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN CIC FFC RCPT 4POS 2.54MM
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패키지: - |
재고3,132 |
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Free Hanging (In-Line) | Receptacle | 4 | 0.100" (2.54mm) | IDC | 0.13-0.28mm, 0.30mm | - | - | Straight | Phosphor Bronze | Gold | Polyester, Glass Filled | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN FFC FPC
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패키지: - |
재고7,722 |
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Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -30°C ~ 85°C | UL94 V-0 |