페이지 472 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PHB143NQ04T,118	NXP	MOSFET N-CH 40V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 52nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 2840pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 200W (Tc) Rds On (Max) @ Id, Vgs: 5.2 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	재고3,184
PSMN005-55B,118	NXP	MOSFET N-CH 55V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 103nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 6500pF @ 25V Vgs (Max): ±15V FET Feature: - Power Dissipation (Max): 230W (Tc) Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	재고3,488
PDTC114YE,135	NXP	TRANS PREBIAS NPN 150MW SC75 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 10k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 150mW Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	패키지: SC-75, SOT-416	재고5,344
TLVH431MQDBZR,215	NXP	IC VREF SHUNT ADJ SOT23-3 Reference Type: Shunt Output Type: Adjustable Voltage - Output (Min/Fixed): 1.24V Voltage - Output (Max): 18V Current - Output: 70mA Tolerance: ±1.5% Temperature Coefficient: - Noise - 0.1Hz to 10Hz: - Noise - 10Hz to 10kHz: - Voltage - Input: - Current - Supply: - Current - Cathode: 80µA Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고4,208
74LVC169PW,112	NXP	IC SYNC 4BIT BIN COUNTER 16TSSOP Logic Type: Binary Counter Direction: Up, Down Number of Elements: 1 Number of Bits per Element: 4 Reset: - Timing: Synchronous Count Rate: 150MHz Trigger Type: Positive Edge Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고3,040
74ABT540D,602	NXP	IC BUFF INVERT 5.5V 20SOIC Logic Type: Buffer, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	패키지: 20-SOIC (0.295", 7.50mm Width)	재고5,808
TDA8953TH/N1,118	NXP	IC AMP AUDIO CLASS D 24HSOP Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 420W x 1 @ 8 Ohm, 210W x 2 @ 4 Ohm Voltage - Supply: ±12.5 V ~ 42.5 V Features: Depop, Differential Inputs, Mute, Short-Circuit Protection Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-HSOP Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	패키지: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	재고6,496
SC28L194A1A,518	NXP	IC UART QUAD 68PLCC Features: Internal Oscillator, Timer/Counter Number of Channels: 4, QUART FIFO's: 16 Byte Protocol: - Data Rate (Max): - Voltage - Supply: 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23)	패키지: 68-LCC (J-Lead)	재고7,584
PCA9672D,512	NXP	IC I/O EXPANDER I2C 8B 16SOIC Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.295", 7.50mm Width)	재고6,688
PCA9539BS,115	NXP	IC I/O EXPANDER I2C/SMBU 24HVQFN Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	패키지: 24-VFQFN Exposed Pad	재고6,128
LPC844M201JBD48E	NXP	32-BIT ARM CORTEX-M0+ Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 30MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal/External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고5,728
MC68HC705C8ACP	NXP	IC MCU 8BIT 8KB OTP 40DIP Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 304 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 40-DIP (0.600", 15.24mm) Supplier Device Package: 40-PDIP	패키지: 40-DIP (0.600", 15.24mm)	재고107,292
MCF51AC256BCPUE	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 20x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고6,912
MKL26Z128VLL4	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 84 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고19,032
LPC4320FET100,551	NXP	IC MCU 32BIT ROMLESS 100TFBGA Core Processor: ARM? Cortex?-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 49 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 4x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-TFBGA Supplier Device Package: 100-TFBGA (9x9)	패키지: 100-TFBGA	재고6,228
NCF29A3MHN/0500IJ	NXP	IC REMOTE KEYLESS ENTRY 32HVQFN Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,948
SA636BS,115	NXP	IC MIXER 500MHZ UP CONV 20HVQFN RF Type: Cellular, ASK, DECT, FSK, UHF, VHF Frequency: 500MHz Number of Mixers: 1 Gain: 11dB Noise Figure: 12dB Secondary Attributes: Up Converter Current - Supply: 6.5mA Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4x4)	패키지: 20-VFQFN Exposed Pad	재고17,760
FSL-ZB-SNF	NXP	KIT ZIGBEE PROTOCOL ANALYZER Type: 802.15.4/Zigbee Frequency: 2.4GHz For Use With/Related Products: ZigBee Networks Supplied Contents: Protocol Analyzer and Sensor Network Analyzer	패키지: -	재고4,410
BGA2003,115	NXP	MMIC AMPLIFIER SOT-343R Frequency: 1.8GHz P1dB: - Gain: 16dB Noise Figure: 1.8dB ~ 2dB RF Type: Cellular, DECT, PHS, SATV Voltage - Supply: 4.5V Current - Supply: 30mA Test Frequency: 900MHz Package / Case: SC-82A, SOT-343 Supplier Device Package: CMPAK-4	패키지: SC-82A, SOT-343	재고3,438
MC33FS6501CAE	NXP	SYSTEM BASIS CHIP DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP Exposed Pad	재고6,352
S912ZVMC64F2WKH	NXP	IC MCU 16BIT FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10x10)	패키지: 64-LQFP Exposed Pad	재고5,040
SPC5566MZP80	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	패키지: 416-BBGA	재고4,272
SPC5748GBK0AVKU6	NXP	TRIPLE CORE, 6M FLASH Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	패키지: 176-LQFP Exposed Pad	재고5,424
SPC5645CF0MMJ1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 199 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고3,264
SPC5775KK2MMY3A	NXP	IC MCU 4MB FLASH 356MAPBGA Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
SAF7771EL-200Z13BY	NXP	SAF7771EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	패키지: -	Request a Quote
S912ZVC64AMKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 16x10b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote
S9S12GN48J0MLH	NXP	S12 CORE,48K FLASH Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote

PHB143NQ04T,118

NXP

MOSFET N-CH 40V 75A D2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 40V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 52nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 2840pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 5.2 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

재고3,184

PSMN005-55B,118

NXP

MOSFET N-CH 55V 75A D2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 103nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 6500pF @ 25V
Vgs (Max): ±15V
FET Feature: -
Power Dissipation (Max): 230W (Tc)
Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

재고3,488

PDTC114YE,135

NXP

TRANS PREBIAS NPN 150MW SC75

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 10k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 150mW
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

패키지: SC-75, SOT-416

재고5,344

TLVH431MQDBZR,215

NXP

IC VREF SHUNT ADJ SOT23-3

Reference Type: Shunt
Output Type: Adjustable
Voltage - Output (Min/Fixed): 1.24V
Voltage - Output (Max): 18V
Current - Output: 70mA
Tolerance: ±1.5%
Temperature Coefficient: -
Noise - 0.1Hz to 10Hz: -
Noise - 10Hz to 10kHz: -
Voltage - Input: -
Current - Supply: -
Current - Cathode: 80µA
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고4,208

74LVC169PW,112

NXP

IC SYNC 4BIT BIN COUNTER 16TSSOP

Logic Type: Binary Counter
Direction: Up, Down
Number of Elements: 1
Number of Bits per Element: 4
Reset: -
Timing: Synchronous
Count Rate: 150MHz
Trigger Type: Positive Edge
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고3,040

74ABT540D,602

NXP

IC BUFF INVERT 5.5V 20SOIC

Logic Type: Buffer, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

패키지: 20-SOIC (0.295", 7.50mm Width)

재고5,808

TDA8953TH/N1,118

NXP

IC AMP AUDIO CLASS D 24HSOP

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 420W x 1 @ 8 Ohm, 210W x 2 @ 4 Ohm
Voltage - Supply: ±12.5 V ~ 42.5 V
Features: Depop, Differential Inputs, Mute, Short-Circuit Protection
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-HSOP
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

패키지: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

재고6,496

SC28L194A1A,518

NXP

IC UART QUAD 68PLCC

Features: Internal Oscillator, Timer/Counter
Number of Channels: 4, QUART
FIFO's: 16 Byte
Protocol: -
Data Rate (Max): -
Voltage - Supply: 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (24.23x24.23)

패키지: 68-LCC (J-Lead)

재고7,584

PCA9672D,512

NXP

IC I/O EXPANDER I2C 8B 16SOIC

Number of I/O: 8
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.295", 7.50mm Width)

재고6,688

PCA9539BS,115

NXP

IC I/O EXPANDER I2C/SMBU 24HVQFN

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

패키지: 24-VFQFN Exposed Pad

재고6,128

LPC844M201JBD48E

NXP

32-BIT ARM CORTEX-M0+

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 30MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal/External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,728

MC68HC705C8ACP

NXP

IC MCU 8BIT 8KB OTP 40DIP

Core Processor: HC05
Core Size: 8-Bit
Speed: 2.1MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 24
Program Memory Size: 8KB (8K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 304 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 40-DIP (0.600", 15.24mm)
Supplier Device Package: 40-PDIP

패키지: 40-DIP (0.600", 15.24mm)

재고107,292

MCF51AC256BCPUE

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 20x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고6,912

MKL26Z128VLL4

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 84
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고19,032

LPC4320FET100,551

NXP

IC MCU 32BIT ROMLESS 100TFBGA

Core Processor: ARM? Cortex?-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 49
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 4x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)

패키지: 100-TFBGA

재고6,228

NCF29A3MHN/0500IJ

NXP

IC REMOTE KEYLESS ENTRY 32HVQFN

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,948

SA636BS,115

NXP

IC MIXER 500MHZ UP CONV 20HVQFN

RF Type: Cellular, ASK, DECT, FSK, UHF, VHF
Frequency: 500MHz
Number of Mixers: 1
Gain: 11dB
Noise Figure: 12dB
Secondary Attributes: Up Converter
Current - Supply: 6.5mA
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-HVQFN (4x4)

패키지: 20-VFQFN Exposed Pad

재고17,760

FSL-ZB-SNF

NXP

KIT ZIGBEE PROTOCOL ANALYZER

Type: 802.15.4/Zigbee
Frequency: 2.4GHz
For Use With/Related Products: ZigBee Networks
Supplied Contents: Protocol Analyzer and Sensor Network Analyzer

패키지: -

재고4,410

BGA2003,115

NXP

MMIC AMPLIFIER SOT-343R

Frequency: 1.8GHz
P1dB: -
Gain: 16dB
Noise Figure: 1.8dB ~ 2dB
RF Type: Cellular, DECT, PHS, SATV
Voltage - Supply: 4.5V
Current - Supply: 30mA
Test Frequency: 900MHz
Package / Case: SC-82A, SOT-343
Supplier Device Package: CMPAK-4

패키지: SC-82A, SOT-343

재고3,438

MC33FS6501CAE

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP Exposed Pad

재고6,352

S912ZVMC64F2WKH

NXP

IC MCU 16BIT FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP-EP (10x10)

패키지: 64-LQFP Exposed Pad

재고5,040

SPC5566MZP80

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z6
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

패키지: 416-BBGA

재고4,272

SPC5748GBK0AVKU6

NXP

TRIPLE CORE, 6M FLASH

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP Exposed Pad

재고5,424

SPC5645CF0MMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고3,264

SPC5775KK2MMY3A

NXP

IC MCU 4MB FLASH 356MAPBGA

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

SAF7771EL-200Z13BY

NXP

SAF7771EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

패키지: -

Request a Quote

S912ZVC64AMKH

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 16x10b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

패키지: -

Request a Quote

S9S12GN48J0MLH

NXP

S12 CORE,48K FLASH

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: -

Request a Quote