페이지 469 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BZX84-B15/LF1VL	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 15V Tolerance: ±2% Power - Max: 250mW Impedance (Max) (Zzt): 30 Ohms Current - Reverse Leakage @ Vr: 50nA @ 10.5V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고7,328
MC33907NAER2	NXP	IC SYSTEM BASIS CAN 0.8A 48LQFP Applications: Power Supply, Automotive Applications Voltage - Input: -1 V ~ 40 V Number of Outputs: 6 Voltage - Output: Multiple Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	패키지: 48-LQFP Exposed Pad	재고4,784
MMPF0100F1AEP	NXP	IC PWR MGMT I.MX6 56QFN Applications: Converter, i.MX6 Voltage - Input: 2.8 V ~ 4.5 V Number of Outputs: 12 Voltage - Output: Multiple Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	패키지: 56-VFQFN Exposed Pad	재고2,672
74HCT257N,652	NXP	IC QUAD 2-IN MUX 3ST INV 16-DIP Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고3,216
74LVT16646ADGG,118	NXP	IC TRANSCVR 16BIT N-INV 56TSSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	패키지: 56-TFSOP (0.240", 6.10mm Width)	재고5,088
74ABT640D,623	NXP	IC TRANSCEIVER 3ST 8BIT 20SOIC Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	패키지: 20-SOIC (0.295", 7.50mm Width)	재고7,840
N74F367N,602	NXP	IC BUFFER DVR HEX N-INV 16DIP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 2, 4 (Hex) Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고3,040
TDA18214HN/C1,557	NXP	IC SILICON TUNER 40HVQFN Type: Tuner Applications: TV Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	패키지: 40-VFQFN Exposed Pad	재고5,680
TDA18274HN/C1,518	NXP	IC TUNER TERR/CATV 40HVQFN Type: Tuner Applications: TV Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	패키지: 40-VFQFN Exposed Pad	재고6,736
TJA1028T/5V0/20/DZ	NXP	IC LIN TXRX SAE 5.0V J2602 8SOIC Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 150°C Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,768
MC7448VU1600LC	NXP	IC MPU MPC74XX 1.6GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.6GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	패키지: 360-CBGA, FCCBGA	재고2,288
PC9RS08KA2PAE	NXP	IC MCU 8BIT 2KB FLASH 8DIP Core Processor: RS08 Core Size: 8-Bit Speed: 10MHz Connectivity: - Peripherals: LVD, POR, WDT Number of I/O: 4 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 63 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	패키지: 8-DIP (0.300", 7.62mm)	재고4,000
MCF5281CVF80	NXP	IC MCU 32BIT 256KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 142 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고3,072
MC56F8006VLC	NXP	IC MCU 16BIT 16KB FLASH 32LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 27 Program Memory Size: 16KB (8K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 16 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 18x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고19,188
S9S12G48F0CLF	NXP	IC MCU 16BIT 48KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고33,600
MCF54418CMJ250	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V4 Core Size: 32-Bit Speed: 250MHz Connectivity: 1-Wire?, CAN, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Number of I/O: 87 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 8x12b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고7,632
PCK9448BD,151	NXP	IC CLK BUFFER 2:12 350MHZ 32LQFP Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:12 Differential - Input:Output: Yes/Yes Input: LVCMOS, LVPECL Output: LVCMOS Frequency - Max: 350MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고5,440
PN5180A0ET/C1,118	NXP	IC RFID TAG 13.56MHZ 64TFBGA Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, ISO 15693, ISO 18000-3 Interface: SPI, UART Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -30°C ~ 85°C Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (5.5x5.5)	패키지: 64-TFBGA	재고29,412
PREV601M	NXP	EVAL BOARD FOR PRH601 Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	패키지: -	재고3,888
TDA18256HN/C1K	NXP	CABLE FST DEMOD 4TS DAC Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고5,680
FS32K146UAT0VLLT	NXP	S32K146 100 LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고6,944
S9S08RNA16W2VLC	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고5,904
FS32K116LIT0VFMT	NXP	IC MCU 32BIT 128KB FLASH 32HVQFN Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 28 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 17K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	패키지: -	Request a Quote
LX2162RN82029B	NXP	IC MPU QORIQ LX 2GHZ 1150FBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: SATA 6Gbps (4) USB: USB 3.0 (1) Voltage - I/O: - Operating Temperature: 5°C ~ 105°C (TA) Security Features: - Package / Case: 1150-FBGA Supplier Device Package: 1150-FBGA (23x23)	패키지: -	재고180
SC5774JK1MMY3AR	NXP	IC Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
FS32K118BRT0VLHT	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 58 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 25K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote
MC33FS8400G0ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	패키지: -	Request a Quote
FB32K146HRT0VLHT	NXP	S32K146 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

BZX84-B15/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 15V
Tolerance: ±2%
Power - Max: 250mW
Impedance (Max) (Zzt): 30 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 10.5V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고7,328

MC33907NAER2

NXP

IC SYSTEM BASIS CAN 0.8A 48LQFP

Applications: Power Supply, Automotive Applications
Voltage - Input: -1 V ~ 40 V
Number of Outputs: 6
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

패키지: 48-LQFP Exposed Pad

재고4,784

MMPF0100F1AEP

NXP

IC PWR MGMT I.MX6 56QFN

Applications: Converter, i.MX6
Voltage - Input: 2.8 V ~ 4.5 V
Number of Outputs: 12
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8)

패키지: 56-VFQFN Exposed Pad

재고2,672

74HCT257N,652

NXP

IC QUAD 2-IN MUX 3ST INV 16-DIP

Type: Multiplexer
Circuit: 4 x 2:1
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고3,216

74LVT16646ADGG,118

NXP

IC TRANSCVR 16BIT N-INV 56TSSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

패키지: 56-TFSOP (0.240", 6.10mm Width)

재고5,088

74ABT640D,623

NXP

IC TRANSCEIVER 3ST 8BIT 20SOIC

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

패키지: 20-SOIC (0.295", 7.50mm Width)

재고7,840

N74F367N,602

NXP

IC BUFFER DVR HEX N-INV 16DIP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 2, 4 (Hex)
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고3,040

TDA18214HN/C1,557

NXP

IC SILICON TUNER 40HVQFN

Type: Tuner
Applications: TV
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

패키지: 40-VFQFN Exposed Pad

재고5,680

TDA18274HN/C1,518

NXP

IC TUNER TERR/CATV 40HVQFN

Type: Tuner
Applications: TV
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

패키지: 40-VFQFN Exposed Pad

재고6,736

TJA1028T/5V0/20/DZ

NXP

IC LIN TXRX SAE 5.0V J2602 8SOIC

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,768

MC7448VU1600LC

NXP

IC MPU MPC74XX 1.6GHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.6GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

패키지: 360-CBGA, FCCBGA

재고2,288

PC9RS08KA2PAE

NXP

IC MCU 8BIT 2KB FLASH 8DIP

Core Processor: RS08
Core Size: 8-Bit
Speed: 10MHz
Connectivity: -
Peripherals: LVD, POR, WDT
Number of I/O: 4
Program Memory Size: 2KB (2K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 63 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

패키지: 8-DIP (0.300", 7.62mm)

재고4,000

MCF5281CVF80

NXP

IC MCU 32BIT 256KB FLASH 256BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 142
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고3,072

MC56F8006VLC

NXP

IC MCU 16BIT 16KB FLASH 32LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 27
Program Memory Size: 16KB (8K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 16
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 18x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고19,188

S9S12G48F0CLF

NXP

IC MCU 16BIT 48KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고33,600

MCF54418CMJ250

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V4
Core Size: 32-Bit
Speed: 250MHz
Connectivity: 1-Wire?, CAN, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Number of I/O: 87
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
Data Converters: A/D 8x12b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고7,632

PCK9448BD,151

NXP

IC CLK BUFFER 2:12 350MHZ 32LQFP

Type: Fanout Buffer (Distribution), Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 2:12
Differential - Input:Output: Yes/Yes
Input: LVCMOS, LVPECL
Output: LVCMOS
Frequency - Max: 350MHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고5,440

PN5180A0ET/C1,118

NXP

IC RFID TAG 13.56MHZ 64TFBGA

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443, ISO 15693, ISO 18000-3
Interface: SPI, UART
Voltage - Supply: 2.7 V ~ 5.5 V
Operating Temperature: -30°C ~ 85°C
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA (5.5x5.5)

패키지: 64-TFBGA

재고29,412

PREV601M

NXP

EVAL BOARD FOR PRH601

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

패키지: -

재고3,888

TDA18256HN/C1K

NXP

CABLE FST DEMOD 4TS DAC

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,680

FS32K146UAT0VLLT

NXP

S32K146 100 LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 24x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고6,944

S9S08RNA16W2VLC

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고5,904

FS32K116LIT0VFMT

NXP

IC MCU 32BIT 128KB FLASH 32HVQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 48MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 28
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 17K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 13x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

패키지: -

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LX2162RN82029B

NXP

IC MPU QORIQ LX 2GHZ 1150FBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 16 Core, 64-Bit
Speed: 2GHz
Co-Processors/DSP: -
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: SATA 6Gbps (4)
USB: USB 3.0 (1)
Voltage - I/O: -
Operating Temperature: 5°C ~ 105°C (TA)
Security Features: -
Package / Case: 1150-FBGA
Supplier Device Package: 1150-FBGA (23x23)

패키지: -

재고180

SC5774JK1MMY3AR

NXP

IC

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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FS32K118BRT0VLHT

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 48MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 58
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 25K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: -

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MC33FS8400G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

패키지: -

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FB32K146HRT0VLHT

NXP

S32K146 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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