페이지 48 - NXP 제품 | Heisener Electronics
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NXP 제품

기록 26,590
페이지  48/950
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hot PMDPB65UP,115
NXP

MOSFET 2P-CH 20V 3.5A SOT1118

  • FET Type: 2 P-Channel (Dual)
  • FET Feature: Logic Level Gate
  • Drain to Source Voltage (Vdss): 20V
  • Current - Continuous Drain (Id) @ 25°C: 3.5A
  • Rds On (Max) @ Id, Vgs: 70 mOhm @ 1A, 4.5V
  • Vgs(th) (Max) @ Id: 1V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs: 6nC @ 4.5V
  • Input Capacitance (Ciss) (Max) @ Vds: 380pF @ 10V
  • Power - Max: 520mW
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 6-UDFN Exposed Pad
  • Supplier Device Package: DFN2020-6
패키지: 6-UDFN Exposed Pad
재고162,000
PBSS5140V,315
NXP

TRANS PNP 40V 1A SOT-666

  • Transistor Type: PNP
  • Current - Collector (Ic) (Max): 1A
  • Voltage - Collector Emitter Breakdown (Max): 40V
  • Vce Saturation (Max) @ Ib, Ic: 310mV @ 100mA, 1A
  • Current - Collector Cutoff (Max): 100nA
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100mA, 5V
  • Power - Max: 500mW
  • Frequency - Transition: 150MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SOT-563, SOT-666
  • Supplier Device Package: SOT-666
패키지: SOT-563, SOT-666
재고2,752
MC33882EPR2
NXP

IC SWITCH LO SIDE 6OUT 32-QFN

  • Switch Type: General Purpose
  • Number of Outputs: 6
  • Ratio - Input:Output: 1:1
  • Output Configuration: Low Side
  • Output Type: N-Channel
  • Interface: SPI, Parallel
  • Voltage - Load: 8 V ~ 25 V
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Current - Output (Max): -
  • Rds On (Typ): 400 mOhm
  • Input Type: -
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 32-VQFN Exposed Pad
  • Supplier Device Package: 32-QFN-EP (7x7)
패키지: 32-VQFN Exposed Pad
재고4,528
SSTU32866EC,518
NXP

IC BUFFER 1.8V 25BIT SOT536-1

  • Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
  • Supply Voltage: 1.7 V ~ 1.9 V
  • Number of Bits: 25, 14
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 96-LFBGA
  • Supplier Device Package: 96-LFBGA (13.5x5.5)
패키지: 96-LFBGA
재고3,712
74HC4015DB,112
NXP

IC DUAL 4BIT SHIFT REGIST 16SSOP

  • Logic Type: Shift Register
  • Output Type: Push-Pull
  • Number of Elements: 2
  • Number of Bits per Element: 4
  • Function: Serial to Parallel
  • Voltage - Supply: 2 V ~ 6 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 16-SSOP
패키지: 16-SSOP (0.209", 5.30mm Width)
재고3,072
N74F164D,623
NXP

IC SHIFT REGISTER 8BIT 14SOIC

  • Logic Type: Shift Register
  • Output Type: Push-Pull
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Function: Serial to Parallel
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SO
패키지: 14-SOIC (0.154", 3.90mm Width)
재고5,040
74LVT543PW,112
NXP

IC TRANSCVR 8BIT N-INV 24TSSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
패키지: 24-TSSOP (0.173", 4.40mm Width)
재고7,584
hot TDA1517P/N3,112
NXP

IC AMP AUDIO PWR 6W STER 18HDIP

  • Type: Class B
  • Output Type: 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 6W x 2 @ 4 Ohm
  • Voltage - Supply: 6 V ~ 18 V
  • Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: 18-HDIP
  • Package / Case: 18-DIP (0.300", 7.62mm) Exposed Pad
패키지: 18-DIP (0.300", 7.62mm) Exposed Pad
재고4,640
PCA9538PW,112
NXP

IC I/O EXPANDER I2C 8B 16TSSOP

  • Number of I/O: 8
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: 16-TSSOP (0.173", 4.40mm Width)
재고12,228
MPC8347ZQAGD
NXP

IC MPU MPC83XX 400MHZ 620BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
패키지: 620-BBGA Exposed Pad
재고2,320
KMPC860SRVR80D4
NXP

IC MPU MPC8XX 80MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 80MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
패키지: 357-BBGA
재고3,184
MPC8272CVRPIEA
NXP

IC MPU MPC82XX 300MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 300MHz
  • Co-Processors/DSP: Communications; RISC CPM, Security; SEC
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
패키지: 516-BBGA
재고3,072
MC8641DVJ1000NE
NXP

IC MPU E600 DUAL CORE 1023FCCBGA

  • Core Processor: PowerPC e600
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BCBGA, FCCBGA
  • Supplier Device Package: 1023-FCCBGA (33x33)
패키지: 1023-BCBGA, FCCBGA
재고2,064
MCIMX6S6AVM08ABR
NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
패키지: 624-LFBGA
재고5,584
MCIMX6L2DVN10AB
NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (3)
  • Voltage - I/O: 1.2V, 1.8V, 3.0V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 432-TFBGA
  • Supplier Device Package: 432-MAPBGA (13x13)
패키지: 432-TFBGA
재고14,694
P87C51FA-5A,512
NXP

IC MCU 8BIT 8KB OTP 44PLCC

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 16MHz
  • Connectivity: EBI/EMI, UART/USART
  • Peripherals: POR, PWM
  • Number of I/O: 32
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
패키지: 44-LCC (J-Lead)
재고6,944
hot MC9RS08KB8CWJ
NXP

IC MCU 8BIT 8KB FLASH 20SOIC

  • Core Processor: RS08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 254 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
패키지: 20-SOIC (0.295", 7.50mm Width)
재고5,584
MC9S08SH8CTGR
NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 13
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: 16-TSSOP (0.173", 4.40mm Width)
재고5,344
MK53DN512CMD10
NXP

IC MCU 32BIT 512KB FLASH 144BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 94
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 41x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
패키지: 144-LBGA
재고4,000
PCK3807ADB,118
NXP

IC CLK BUFFER 1:10 400MHZ 20SSOP

  • Type: Fanout Buffer (Distribution)
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:10
  • Differential - Input:Output: No/No
  • Input: LVCMOS, LVTTL
  • Output: LVTTL
  • Frequency - Max: 400MHz
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 20-SSOP
패키지: 20-SSOP (0.209", 5.30mm Width)
재고2,160
TEF6890H/V3,557
NXP

IC RADIO SIGNAL PROC 44-QFP

  • Function: Audio Tone Processor
  • Applications: Automotive Audio
  • Number of Channels: 6
  • Interface: I2C
  • Voltage - Supply: 8 V ~ 9 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Specifications: AM, FM
  • Package / Case: 44-QFP
  • Supplier Device Package: 44-PQFP (10x10)
패키지: 44-QFP
재고6,864
MPVZ12GW6U
NXP

SENSOR PRESSURE AXIAL SO8 SMD

  • Pressure Type: Vented Gauge
  • Operating Pressure: 1.45 PSI (10 kPa)
  • Output Type: Wheatstone Bridge
  • Output: 0 mV ~ 55 mV (3V)
  • Accuracy: -
  • Voltage - Supply: 3 V ~ 6 V
  • Port Size: Male - 0.22" (5.59mm) Tube
  • Port Style: Barbless
  • Features: -
  • Termination Style: PCB
  • Maximum Pressure: 10.88 PSI (75 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 8-SMD Module
  • Supplier Device Package: -
패키지: 8-SMD Module
재고7,812
KMA221J
NXP

MOD ANGLE SENSOR MAGN 2CH SIL4

  • For Measuring: Angle
  • Technology: Magnetoresistive
  • Rotation Angle - Electrical, Mechanical: 0° ~ 180°
  • Linear Range: -
  • Output: Analog Voltage
  • Output Signal: -
  • Actuator Type: External Magnet Not Included
  • Linearity: ±1.2°
  • Resistance: -
  • Resistance Tolerance: -
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Termination Style: PC Pin
  • Operating Temperature: -40°C ~ 160°C
패키지: -
재고7,416
MFRC52302HN1,157
NXP

IC READER 32-HVQFN

  • Type: RFID Reader
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE
  • Interface: I2C, SPI, UART
  • Voltage - Supply: 2.5 V ~ 3.3 V
  • Operating Temperature: -25°C ~ 85°C
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
패키지: 32-VFQFN Exposed Pad
재고5,850
HTSICC5601EW/C7,00
NXP

TRANSPONDER RFIC HITAG S UNCASED

  • Type: RFID Transponder
  • Frequency: 100kHz ~ 150kHz
  • Standards: -
  • Interface: -
  • Voltage - Supply: 3.5V
  • Operating Temperature: -25°C ~ 85°C
  • Package / Case: Die
  • Supplier Device Package: Die
패키지: Die
재고2,088
TEA19031AGT/1J
NXP

SMART CHARGING PROTOCOL CONTR US

  • Output Isolation: -
  • Internal Switch(s): -
  • Voltage - Breakdown: -
  • Topology: -
  • Voltage - Start Up: -
  • Voltage - Supply (Vcc/Vdd): -
  • Duty Cycle: -
  • Frequency - Switching: -
  • Power (Watts): -
  • Fault Protection: -
  • Control Features: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
  • Mounting Type: -
패키지: -
재고4,528
SPC5748GSK1MMJ6R
NXP

NXP 32-BIT MCU, TRIPLE CORE, 6MB

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz
  • Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, LVD, I2S, POR, WDT
  • Number of I/O: 246
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
  • Data Converters: A/D 80x10b, 64x12b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
패키지: -
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MC35FS4507NAE
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote