페이지 50 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF281ZR1	NXP	FET RF 65V 1.93GHZ NI-200Z Transistor Type: LDMOS Frequency: 1.93GHz Gain: 12.5dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 25mA Power - Output: 4W Voltage - Rated: 65V Package / Case: NI-200Z Supplier Device Package: NI-200Z	패키지: NI-200Z	재고7,408
N74F139D,623	NXP	IC DECODER/DEMUX 2-4LINE 16SOIC Type: Decoder/Demultiplexer Circuit: 1 x 2:4 Independent Circuits: 2 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고4,336
74AHC74PW/AUJ	NXP	IC FLIP-FLOP DUAL D POS 14TSSOP Function: Set(Preset) and Reset Type: D-Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 115MHz Max Propagation Delay @ V, Max CL: 9.3ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 8mA, 8mA Voltage - Supply: 2 V ~ 5.5 V Current - Quiescent (Iq): 2µA Input Capacitance: 3pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width)	패키지: 14-TSSOP (0.173", 4.40mm Width)	재고3,920
TDA19989AET/C189,5	NXP	IC HDMI INTERFACE 1.3A 64TFBGA Type: HDMI Transmitter Applications: Cameras, Cell Phones, Media Players Mounting Type: Surface Mount Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (4.5x4.5)	패키지: 64-TFBGA	재고2,224
MPC8548ECVTAQGD	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고6,304
MPC8535BVTATHA	NXP	IC MPU MPC85XX 1.25GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고7,968
MCE360CZQ25LR2	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고3,792
KMPC8541EVTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고7,456
MPC859TCVR100A	NXP	IC MPU MPC8XX 100MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고2,944
MC68711E20MFNE2	NXP	IC MCU 8BIT 20KB OTP 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	패키지: 52-LCC (J-Lead)	재고7,632
MCR908JK3ECPE	NXP	IC MCU 8BIT 4KB FLASH 20DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LED, LVD, POR, PWM Number of I/O: 15 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	패키지: 20-DIP (0.300", 7.62mm)	재고3,120
P89C51RC2BBD/01,55	NXP	IC MCU 8BIT 32KB FLASH 44LQFP Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	패키지: 44-LQFP	재고5,456
S912XHZ512F1VAL	NXP	IC MCU 16BIT 512KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고13,920
MC9RS08KA4CWG	NXP	IC MCU 8BIT 4KB FLASH 16SOIC Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 126 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고168,384
DSP56303VF100	NXP	IC DSP 24BIT 100MHZ 196-BGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-LBGA	재고131,796
MWCT1001AVLHR	NXP	5W MULTI-COIL AUTO 5V STANDAR Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고2,336
TJA1057GTK/3Z	NXP	HIGH-SPEED CAN TRANSCEIVER Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 300mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	패키지: 8-VDFN Exposed Pad	재고5,168
MCIMX6QP5EVT2AA	NXP	I.MX 6QUADPLUS MPU 4X ARM CORTE Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	패키지: 624-FBGA, FCBGA	재고6,912
MCIMX6Q5EZK08AD	NXP	I.MX 6 SERIES 32-BIT MPU DUAL A Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 569-LFBGA Supplier Device Package: 569-MAPBGA (12x12)	패키지: 569-LFBGA	재고5,040
SPC5777CSK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	패키지: 416-BGA	재고7,984
S9S12P128J0VLH	NXP	16-BIT MCU S12 CORE 128KB FLAS Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 49 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고3,840
MFS8622BMBA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	패키지: -	Request a Quote
A3T23H450W23SR6	NXP	RF MOSFET LDMOS Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
S32K328GHT1VPCSR	NXP	IC Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: 142 Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 1.125M x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 172-QFP Exposed Pad Supplier Device Package: 172-QFP-EP	패키지: -	Request a Quote
FS32R372SDK0MMVT	NXP	IC MCU 32B 1.3MB FLASH 141MAPBGA Core Processor: e200z7260 Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH EEPROM Size: 32K x 8 RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 141-LFBGA Supplier Device Package: 141-MAPBGA (10x10)	패키지: -	Request a Quote
MC56F81746VLF	NXP	IC DSC 64KB/12KB LQPF48 Type: - Interface: I2C, SCI, SPI Clock Rate: 100MHz Non-Volatile Memory: FLASH (64kB) On-Chip RAM: 12kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote
MCXA152VFM	NXP	IC MCX 96MHZ SGL CORE 64KB QFN32 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
LPC5502JBD64K	NXP	IC MCU 32BIT 64KB FLASH 64TQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	패키지: -	Request a Quote

MRF281ZR1

NXP

FET RF 65V 1.93GHZ NI-200Z

Transistor Type: LDMOS
Frequency: 1.93GHz
Gain: 12.5dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 25mA
Power - Output: 4W
Voltage - Rated: 65V
Package / Case: NI-200Z
Supplier Device Package: NI-200Z

패키지: NI-200Z

재고7,408

N74F139D,623

NXP

IC DECODER/DEMUX 2-4LINE 16SOIC

Type: Decoder/Demultiplexer
Circuit: 1 x 2:4
Independent Circuits: 2
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고4,336

74AHC74PW/AUJ

NXP

IC FLIP-FLOP DUAL D POS 14TSSOP

Function: Set(Preset) and Reset
Type: D-Type
Output Type: Differential
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 115MHz
Max Propagation Delay @ V, Max CL: 9.3ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 2 V ~ 5.5 V
Current - Quiescent (Iq): 2µA
Input Capacitance: 3pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)

패키지: 14-TSSOP (0.173", 4.40mm Width)

재고3,920

TDA19989AET/C189,5

NXP

IC HDMI INTERFACE 1.3A 64TFBGA

Type: HDMI Transmitter
Applications: Cameras, Cell Phones, Media Players
Mounting Type: Surface Mount
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA (4.5x4.5)

패키지: 64-TFBGA

재고2,224

MPC8548ECVTAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고6,304

MPC8535BVTATHA

NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고7,968

MCE360CZQ25LR2

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고3,792

KMPC8541EVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고7,456

MPC859TCVR100A

NXP

IC MPU MPC8XX 100MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 100MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 100°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고2,944

MC68711E20MFNE2

NXP

IC MCU 8BIT 20KB OTP 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 4MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: 20KB (20K x 8)
Program Memory Type: OTP
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

패키지: 52-LCC (J-Lead)

재고7,632

MCR908JK3ECPE

NXP

IC MCU 8BIT 4KB FLASH 20DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LED, LVD, POR, PWM
Number of I/O: 15
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
Data Converters: A/D 12x8b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

패키지: 20-DIP (0.300", 7.62mm)

재고3,120

P89C51RC2BBD/01,55

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

패키지: 44-LQFP

재고5,456

S912XHZ512F1VAL

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 85
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 16x8/10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고13,920

MC9RS08KA4CWG

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

Core Processor: RS08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 126 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고168,384

DSP56303VF100

NXP

IC DSP 24BIT 100MHZ 196-BGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 100MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-LBGA

재고131,796

MWCT1001AVLHR

NXP

5W MULTI-COIL AUTO 5V STANDAR

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고2,336

TJA1057GTK/3Z

NXP

HIGH-SPEED CAN TRANSCEIVER

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 300mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

패키지: 8-VDFN Exposed Pad

재고5,168

MCIMX6QP5EVT2AA

NXP

I.MX 6QUADPLUS MPU 4X ARM CORTE

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

패키지: 624-FBGA, FCBGA

재고6,912

MCIMX6Q5EZK08AD

NXP

I.MX 6 SERIES 32-BIT MPU DUAL A

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 569-LFBGA
Supplier Device Package: 569-MAPBGA (12x12)

패키지: 569-LFBGA

재고5,040

SPC5777CSK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

패키지: 416-BGA

재고7,984

S9S12P128J0VLH

NXP

16-BIT MCU S12 CORE 128KB FLAS

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 49
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 6K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고3,840

MFS8622BMBA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

패키지: -

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A3T23H450W23SR6

NXP

RF MOSFET LDMOS

Transistor Type: -
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: -
Package / Case: -
Supplier Device Package: -

패키지: -

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S32K328GHT1VPCSR

NXP

IC

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 240MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 142
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 1.125M x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 172-QFP Exposed Pad
Supplier Device Package: 172-QFP-EP

패키지: -

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FS32R372SDK0MMVT

NXP

IC MCU 32B 1.3MB FLASH 141MAPBGA

Core Processor: e200z7260
Core Size: 32-Bit Dual-Core
Speed: 240MHz
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.3MB (1.3M x 8)
Program Memory Type: FLASH
EEPROM Size: 32K x 8
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 141-LFBGA
Supplier Device Package: 141-MAPBGA (10x10)

패키지: -

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MC56F81746VLF

NXP

IC DSC 64KB/12KB LQPF48

Type: -
Interface: I2C, SCI, SPI
Clock Rate: 100MHz
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

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MCXA152VFM

NXP

IC MCX 96MHZ SGL CORE 64KB QFN32

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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LPC5502JBD64K

NXP

IC MCU 32BIT 64KB FLASH 64TQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 96MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 45
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 9x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

패키지: -

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