페이지 176 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
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Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
페이지  176/202
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제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XCV2000E-7FG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 804
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
패키지: 1156-BBGA
재고9,468
43200
655360
804
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV2000E-7BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 404
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고5,328
43200
655360
404
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV2000E-7BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 404
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고6,064
43200
655360
404
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV2000E-6FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 660
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
패키지: 860-BGA
재고5,440
43200
655360
660
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV2000E-6FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 660
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
패키지: 860-BGA
재고3,280
43200
655360
660
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
hot XCV2000E-6FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 512
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
패키지: 680-LBGA Exposed Pad
재고4,976
43200
655360
512
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV2000E-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 512
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
패키지: 680-LBGA Exposed Pad
재고4,880
43200
655360
512
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV2000E-6FG1156I
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 804
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
패키지: 1156-BBGA
재고2,848
43200
655360
804
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
1156-BBGA
1156-FBGA (35x35)
hot XCV2000E-6FG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 804
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
패키지: 1156-BBGA
재고6,320
43200
655360
804
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV2000E-6BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 404
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고7,904
43200
655360
404
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV2000E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 404
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고6,416
43200
655360
404
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV200-6PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 166
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고6,608
5292
57344
166
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV200-6FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 284
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고6,944
5292
57344
284
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV200-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 176
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고5,648
5292
57344
176
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV200-6BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 260
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고6,048
5292
57344
260
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV200-6BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 180
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
패키지: 256-BBGA
재고7,200
5292
57344
180
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BBGA
256-PBGA (27x27)
hot XCV200-5PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 166
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고7,800
5292
57344
166
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV200-5PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 166
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고6,832
5292
57344
166
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
XCV200-5FG456I
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 284
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고3,376
5292
57344
284
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV200-5FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 284
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고3,104
5292
57344
284
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV200-5FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 176
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고5,376
5292
57344
176
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV200-5FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 176
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고27,036
5292
57344
176
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV200-5BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 260
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고6,288
5292
57344
260
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV200-5BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 260
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고4,144
5292
57344
260
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
XCV200-5BG256I
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 180
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
패키지: 256-BBGA
재고5,248
5292
57344
180
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BBGA
256-PBGA (27x27)
XCV200-5BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 180
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
패키지: 256-BBGA
재고7,792
5292
57344
180
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BBGA
256-PBGA (27x27)
hot XCV200-4PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 166
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고11,340
5292
57344
166
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV200-4PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 166
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고11,184
5292
57344
166
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)