페이지 179 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
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Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
페이지  179/202
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XCV400-4BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 81920
  • Number of I/O: 316
  • Number of Gates: 468252
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고15,336
10800
81920
316
468252
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XCV3200E-7CG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156CBGA

  • Number of LABs/CLBs: 16224
  • Number of Logic Elements/Cells: 73008
  • Total RAM Bits: 851968
  • Number of I/O: 804
  • Number of Gates: 4074387
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BCBGA
  • Supplier Device Package: 1156-CBGA (35x35)
패키지: 1156-BCBGA
재고4,784
73008
851968
804
4074387
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BCBGA
1156-CBGA (35x35)
XCV3200E-6CG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156CBGA

  • Number of LABs/CLBs: 16224
  • Number of Logic Elements/Cells: 73008
  • Total RAM Bits: 851968
  • Number of I/O: 804
  • Number of Gates: 4074387
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BCBGA
  • Supplier Device Package: 1156-CBGA (35x35)
패키지: 1156-BCBGA
재고6,528
73008
851968
804
4074387
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BCBGA
1156-CBGA (35x35)
hot XCV300E-8PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 158
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고6,996
6912
131072
158
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300E-8FG456C
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 312
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고6,880
6912
131072
312
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV300E-8FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 176
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고7,848
6912
131072
176
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV300E-8BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 316
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고15,480
6912
131072
316
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XCV300E-8BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 260
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고5,920
6912
131072
260
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV300E-7PQ240I
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 158
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고17,040
6912
131072
158
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300E-7PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 158
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고5,680
6912
131072
158
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300E-7FG456I
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 312
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고16,032
6912
131072
312
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV300E-7FG456C
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 312
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고6,544
6912
131072
312
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV300E-7FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 176
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고6,640
6912
131072
176
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
XCV300E-7FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 176
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고4,240
6912
131072
176
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV300E-7BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 316
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고2,464
6912
131072
316
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV300E-7BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 316
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고5,072
6912
131072
316
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XCV300E-7BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 260
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고5,472
6912
131072
260
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
XCV300E-7BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 260
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고4,752
6912
131072
260
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV300E-6PQ240I
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 158
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고5,536
6912
131072
158
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300E-6PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 158
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP
재고5,632
6912
131072
158
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300E-6FG456I
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 312
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고7,376
6912
131072
312
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV300E-6FG456C
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 312
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고17,652
6912
131072
312
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV300E-6FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 176
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고6,352
6912
131072
176
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV300E-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 176
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고12,492
6912
131072
176
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV300E-6BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 316
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고3,376
6912
131072
316
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV300E-6BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 316
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고9,348
6912
131072
316
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV300E-6BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 260
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고4,736
6912
131072
260
411955
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV300E-6BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 260
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
패키지: 352-LBGA, Metal
재고7,280
6912
131072
260
411955
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)