이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고6,160 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고3,232 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고6,704 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고3,248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.8GHZ
|
패키지: 36-WFQFN Exposed Pad |
재고7,536 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
패키지: 36-WFQFN Exposed Pad |
재고7,760 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
패키지: 36-WFQFN Exposed Pad |
재고6,800 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
패키지: 36-WFQFN Exposed Pad |
재고6,816 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고6,736 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고2,000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고25,200 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고7,296 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고60,000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고44,400 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고18,000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고63,600 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고108,000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
패키지: 12-WFDFN Exposed Pad |
재고84,000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고19,644 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
패키지: 12-TSSOP (0.118", 3.00mm Width) |
재고15,552 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 12-WFDFN Exposed Pad |
재고4,976 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 12-WFDFN Exposed Pad |
재고7,792 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 12-WFDFN Exposed Pad |
재고5,264 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 12-WFDFN Exposed Pad |
재고5,248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 36-WFQFN Exposed Pad |
재고7,280 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 36-WFQFN Exposed Pad |
재고4,320 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 36-WFQFN Exposed Pad |
재고7,088 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
패키지: 36-WFQFN Exposed Pad |
재고5,952 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |