Molex, LLC 제품 - IC용 소켓, 트랜지스터 | Heisener Electronics
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Molex, LLC 제품 - IC용 소켓, 트랜지스터

기록 33
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이미지
부품 번호
제조업체
설명
패키지
재고
수량
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
0475943001
Molex, LLC

CONN SOCKET LGA 1356POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 1356 (32 x 41)
  • Pitch - Mating: 0.040" (1.01mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: -
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
패키지: -
재고4,662
1356 (32 x 41)
0.040" (1.01mm)
Gold
15µin (0.38µm)
-
Surface Mount
Open Frame
-
-
-
-
-
-
-
0475940002
Molex, LLC

CONN SOCKET LGA 1366POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 1366 (32 x 41)
  • Pitch - Mating: 0.040" (1.01mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.040" (1.01mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고7,038
1366 (32 x 41)
0.040" (1.01mm)
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0475940001
Molex, LLC

CONN SOCKET LGA 1366POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 1366 (32 x 41)
  • Pitch - Mating: 0.040" (1.01mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.040" (1.01mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고6,444
1366 (32 x 41)
0.040" (1.01mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0475939000
Molex, LLC

CONN SOCKET LGA 1366POS NICKEL

  • Type: LGA
  • Number of Positions or Pins (Grid): 1366 (32 x 41)
  • Pitch - Mating: -
  • Contact Finish - Mating: Nickel
  • Contact Finish Thickness - Mating: 3µin (0.08µm)
  • Contact Material - Mating: -
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Nickel
  • Contact Finish Thickness - Post: 3µin (0.08µm)
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
패키지: -
재고2,718
1366 (32 x 41)
-
Nickel
3µin (0.08µm)
-
Surface Mount
Closed Frame
Solder
-
Nickel
3µin (0.08µm)
-
-
-
0479890242
Molex, LLC

CONN SOCKET PGA 988POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 988 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고5,130
988 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0479890232
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고8,550
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0479890222
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고8,586
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0479890212
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고6,858
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0479890142
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고8,406
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0479890132
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고6,606
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0479890122
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고6,012
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0479890112
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
패키지: -
재고2,502
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
0009483031
Molex, LLC

CONN SOCKET TRANSIST TO-220 3POS

  • Type: Transistor, TO-220
  • Number of Positions or Pins (Grid): 3 (Rectangular)
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 100µin (2.54µm)
  • Contact Material - Mating: Brass
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 100µin (2.54µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA66), Nylon 6/6
  • Operating Temperature: -40°C ~ 80°C
패키지: -
재고2,304
3 (Rectangular)
-
Tin
100µin (2.54µm)
Brass
Through Hole
Closed Frame
Solder
-
Tin
100µin (2.54µm)
Brass
Polyamide (PA66), Nylon 6/6
-40°C ~ 80°C
1051420433
Molex, LLC

LGA2011-3 SOCKET FULL ASSY 30U'

  • Type: -
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: -
  • Features: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
패키지: -
재고5,976
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1051420133
Molex, LLC

CONN SOCKET LGA 2011POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 2011 (47 x 58)
  • Pitch - Mating: 0.040" (1.01mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.040" (1.01mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Thermoplastic
  • Operating Temperature: -
패키지: -
재고3,924
2011 (47 x 58)
0.040" (1.01mm)
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Thermoplastic
-
1051420432
Molex, LLC

LGA2011-3 SOCKET FULL ASSY 15U'

  • Type: -
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: -
  • Features: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
패키지: -
재고3,762
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1051420132
Molex, LLC

CONN SOCKET LGA 2011POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 2011 (47 x 58)
  • Pitch - Mating: 0.040" (1.01mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.040" (1.01mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Thermoplastic
  • Operating Temperature: -
패키지: -
재고6,030
2011 (47 x 58)
0.040" (1.01mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Thermoplastic
-
1050282031
Molex, LLC

CONN CAMERA SOCKET 32POS GOLD

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 32 (4 x 8)
  • Pitch - Mating: 0.035" (0.90mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 3µin (0.08µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.035" (0.90mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Plastic
  • Operating Temperature: -
패키지: -
재고5,364
32 (4 x 8)
0.035" (0.90mm)
Gold
3µin (0.08µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.035" (0.90mm)
Gold
Flash
Copper Alloy
Plastic
-
0784990002
Molex, LLC

CONN CAM SOCKET 24POS GOLD

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 24 (2 x 4, 2 x 8)
  • Pitch - Mating: 0.024" (0.60mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.024" (0.60mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Plastic
  • Operating Temperature: -55°C ~ 85°C
패키지: -
재고8,568
24 (2 x 4, 2 x 8)
0.024" (0.60mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.024" (0.60mm)
Gold
Flash
Copper Alloy
Plastic
-55°C ~ 85°C
0473370001
Molex, LLC

CONN CAM SOCKET 24POS GOLD

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 24 (4 x 6)
  • Pitch - Mating: 0.035" (0.90mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.035" (0.90mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyamide (PA), Nylon
  • Operating Temperature: -55°C ~ 85°C
패키지: -
재고7,200
24 (4 x 6)
0.035" (0.90mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.035" (0.90mm)
Gold
Flash
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 85°C
0787250002
Molex, LLC

SMIA85 CAMERA SOCKET T/BRD 18PIN

  • Type: -
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: -
  • Features: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
패키지: -
재고8,550
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1051990001
Molex, LLC

CONN CAM SOCKET 34POS GOLD

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 34 (2 x 8, 2 x 9)
  • Pitch - Mating: 0.024" (0.60mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.024" (0.60mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Copper Alloy
  • Housing Material: Plastic
  • Operating Temperature: -30°C ~ 85°C
패키지: -
재고5,652
34 (2 x 8, 2 x 9)
0.024" (0.60mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.024" (0.60mm)
-
-
Copper Alloy
Plastic
-30°C ~ 85°C
1052000008
Molex, LLC

SMIA55 CAMERA SOCKET BOTTOM CONT

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 12 (2 x 6)
  • Pitch - Mating: 0.028" (0.70mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount, Through Board
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.028" (0.70mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 85°C
패키지: -
재고8,406
12 (2 x 6)
0.028" (0.70mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount, Through Board
Open Frame
Solder
0.028" (0.70mm)
Gold
Flash
Copper Alloy
Thermoplastic
-55°C ~ 85°C
1052000001
Molex, LLC

SMIA55 CAMERA SOCKET BOTTOM CONT

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 12 (2 x 6)
  • Pitch - Mating: 0.028" (0.70mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount, Through Board
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.028" (0.70mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 85°C
패키지: -
재고3,438
12 (2 x 6)
0.028" (0.70mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount, Through Board
Open Frame
Solder
0.028" (0.70mm)
Gold
Flash
Copper Alloy
Thermoplastic
-55°C ~ 85°C
1051900001
Molex, LLC

TOP-MOUNT CAMERA SOCKET FOR SMIA

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 12 (2 x 6)
  • Pitch - Mating: 0.033" (0.85mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Phosphor Bronze Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.033" (0.85mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Phosphor Bronze Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 85°C
패키지: -
재고8,154
12 (2 x 6)
0.033" (0.85mm)
Gold
12µin (0.30µm)
Phosphor Bronze Alloy
Surface Mount
Open Frame
Solder
0.033" (0.85mm)
Gold
Flash
Phosphor Bronze Alloy
Thermoplastic
-55°C ~ 85°C
1051670001
Molex, LLC

SMIA65 TOP MNT CAMERA SOCKET

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 12 (2 x 6)
  • Pitch - Mating: 0.037" (0.95mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 85°C
패키지: -
재고5,364
12 (2 x 6)
0.037" (0.95mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount
Open Frame
Solder
-
Gold
Flash
Copper Alloy
Thermoplastic
-55°C ~ 85°C
1051631001
Molex, LLC

SMIA65 CAMERA SOCKET CONTACT

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 12 (2 x 6)
  • Pitch - Mating: 0.037" (0.95mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount, Through Board
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.037" (0.95mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 85°C
패키지: -
재고6,714
12 (2 x 6)
0.037" (0.95mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount, Through Board
Open Frame
Solder
0.037" (0.95mm)
Gold
Flash
Copper Alloy
Thermoplastic
-55°C ~ 85°C
hot 1050281001
Molex, LLC

CONN CAM SOCKET 32POS GOLD

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 32 (4 x 8)
  • Pitch - Mating: 0.035" (0.90mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 3µin (0.08µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.035" (0.90mm)
  • Contact Finish - Post: Nickel
  • Contact Finish Thickness - Post: 50µin (1.27µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -
패키지: -
재고7,020
32 (4 x 8)
0.035" (0.90mm)
Gold
3µin (0.08µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.035" (0.90mm)
Nickel
50µin (1.27µm)
Copper Alloy
Thermoplastic
-