페이지 2 - Molex, LLC 제품 - IC용 소켓, 트랜지스터

부품 번호	제조업체	설명	패키지	재고	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
0475962032	Molex, LLC	CONN SOCKET LGA 1155POS Type: LGA Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	패키지: -	재고6,192	-	-	-	-	-	-	-	-	-	-	-	-	-	-
0475960532	Molex, LLC	CONN SOCKET LGA 1156POS GOLD Type: LGA Number of Positions or Pins (Grid): 1156 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	패키지: -	재고2,682	1156 (40 x 40)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
0475960233	Molex, LLC	CONN SOCKET LGA 1155POS GOLD Type: LGA Number of Positions or Pins (Grid): 1155 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	패키지: -	재고7,452	1155 (40 x 40)	0.036" (0.91mm)	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
0475960232	Molex, LLC	CONN SOCKET LGA 1155POS GOLD Type: LGA Number of Positions or Pins (Grid): 1155 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	패키지: -	재고3,726	1155 (40 x 40)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
0475960132	Molex, LLC	CONN SOCKET LGA 1156POS GOLD Type: LGA Number of Positions or Pins (Grid): 1156 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	패키지: -	재고6,408	1156 (40 x 40)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-