이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Frequency | Standards | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC TRANSPONDER RFID HITAG
|
패키지: Die |
재고2,178 |
|
100kHz ~ 150kHz | ISO 11784, ISO 11785 | - | 4 V ~ 6 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
MIFARE CLASSIC SMART CARD IC
|
패키지: Die |
재고6,444 |
|
13.56MHz | ISO 14443 | UART | - | -25°C ~ 70°C | Die | Die |
||
NXP |
MIFARE CLASSIC SMART CARD IC
|
패키지: - |
재고6,318 |
|
- | - | - | - | - | - | - |
||
NXP |
MIFARE CLASSIC SMART CARD IC
|
패키지: Die |
재고6,732 |
|
13.56MHz | ISO 14443 | UART | - | -25°C ~ 70°C | Die | Die |
||
NXP |
MIFARE CLASSIC SMART CARD IC
|
패키지: Die |
재고6,840 |
|
13.56MHz | ISO 14443 | UART | - | -25°C ~ 70°C | Die | Die |
||
NXP |
MIFARE CLASSIC SMART CARD IC
|
패키지: Die |
재고3,852 |
|
13.56MHz | ISO 14443 | UART | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC U-CODE RF FE DUAL DIFF 8XQFN
|
패키지: 8-XFQFN Exposed Pad |
재고5,652 |
|
860MHz ~ 960MHz | ISO 18000-6 | I2C | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) |
||
NXP |
MIFARE CLASSIC SMART CARD IC
|
패키지: Die |
재고6,516 |
|
13.56MHz | ISO 14443 | UART | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC HITAG-S 256BIT MOA2 PLLMC
|
패키지: MOA4, Smart Card Module |
재고5,256 |
|
100kHz ~ 150kHz | ISO 14223, ISO 11784, ISO 11785, ISO 18000-2 | - | - | -25°C ~ 85°C | MOA4, Smart Card Module | PLLMC |
||
NXP |
IC MIFARE ULTRALIGHT FCP PLLMC
|
패키지: MOA4, Smart Card Module |
재고8,154 |
|
13.56MHz | ISO 14443, MIFARE, NFC | - | - | -25°C ~ 70°C | MOA4, Smart Card Module | PLLMC |
||
NXP |
IC MIFARE ULTRALIGHT FCP PLLMC
|
패키지: MOA4, Smart Card Module |
재고3,438 |
|
13.56MHz | ISO 14443, MIFARE, NFC | - | - | -25°C ~ 70°C | MOA4, Smart Card Module | PLLMC |
||
NXP |
IC I-CODE SLI 3XSON
|
패키지: - |
재고3,978 |
|
- | - | - | - | - | - | - |
||
NXP |
IC MIFARE ULTRALIGHT FCP PLLMC
|
패키지: MOA4, Smart Card Module |
재고204,648 |
|
13.56MHz | ISO 14443, MIFARE | - | - | -25°C ~ 70°C | MOA4, Smart Card Module | - |
||
NXP |
IC I-CODE SLI PLLMC
|
패키지: - |
재고2,466 |
|
- | - | - | - | - | - | - |
||
NXP |
IC MIFARE ULTRALIGHT EV1 PLLMC
|
패키지: MOA8, Smart Card Module |
재고6,246 |
|
13.56MHz | ISO 14443, MIFARE | - | - | -25°C ~ 70°C | MOA8, Smart Card Module | PLLMC |
||
NXP |
IC I-CODE SLI 3XSON
|
패키지: 3-XDFN |
재고6,912 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | 3-XDFN | 3-XSON (1x1.45) |
||
NXP |
IC I-CODE SLI UNCASED FOIL
|
패키지: Die |
재고4,824 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Die |
||
NXP |
IC NFC TAG TYPE 2 888BYTE IC
|
패키지: Die |
재고2,754 |
|
13.56MHz | ISO 14443 | - | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC I-CODE SLI UNCASED FOIL
|
패키지: Die |
재고3,024 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | - |
||
NXP |
IC I-CODE SLI 3XSON
|
패키지: 3-XDFN |
재고5,958 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | 3-XDFN | 3-XSON (1x1.45) |
||
NXP |
IC I-CODE ILT-M 3XSON
|
패키지: - |
재고6,372 |
|
- | - | - | - | - | - | - |
||
NXP |
IC I-CODE ILT-M 3XSON
|
패키지: 3-XDFN |
재고5,274 |
|
13.56MHz | ISO 18000-6, EPC | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | 3-XDFN | 3-XSON (1x1.45) |
||
NXP |
IC I-CODE ILT-M 3XSON
|
패키지: - |
재고2,268 |
|
- | - | - | - | - | - | - |
||
NXP |
TRANSPONDER RFIC HITAG S UNCASED
|
패키지: Die |
재고5,742 |
|
100kHz ~ 150kHz | - | - | 3.5V | -25°C ~ 85°C | Die | Die |
||
NXP |
IC TRANSPONDER HITAG
|
패키지: Die |
재고6,624 |
|
100kHz ~ 150kHz | ISO 11784, ISO 11785 | - | 4 V ~ 6 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC UCODE G2XL FTB1 3XSON
|
패키지: 3-XDFN |
재고2,322 |
|
840MHz ~ 960MHz | EPC, ISO 15693, ISO 18000-6 | - | - | -40°C ~ 85°C | 3-XDFN | 3-XSON (1x1.45) |
||
NXP |
TRANSPONDER RFIC HITAG S UNCASED
|
패키지: Die |
재고2,088 |
|
100kHz ~ 150kHz | - | - | 3.5V | -25°C ~ 85°C | Die | Die |
||
NXP |
IC UCODE G2XL SOT886
|
패키지: 6-XFDFN |
재고3,096 |
|
840MHz ~ 960MHz | ISO 18000-6, EPC | - | 1.8V | -40°C ~ 85°C | 6-XFDFN | 6-XSON, SOT886 (1.45x1) |