페이지 95 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  95/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RN73C2A8K45BTDF
TE Connectivity Passive Product

RES SMD 8.45KOHM 0.1% 1/10W 0805

  • Resistance: 8.45 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고13,224
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A768RBTDF
TE Connectivity Passive Product

RES SMD 768 OHM 0.1% 1/10W 0805

  • Resistance: 768 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,820
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A3K09BTDF
TE Connectivity Passive Product

RES SMD 3.09KOHM 0.1% 1/10W 0805

  • Resistance: 3.09 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고22,896
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A549RBTDF
TE Connectivity Passive Product

RES SMD 549 OHM 0.1% 1/10W 0805

  • Resistance: 549 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고14,340
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A453RBTDF
TE Connectivity Passive Product

RES SMD 453 OHM 0.1% 1/10W 0805

  • Resistance: 453 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,208
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A9K31BTDF
TE Connectivity Passive Product

RES SMD 9.31KOHM 0.1% 1/10W 0805

  • Resistance: 9.31 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고20,484
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A15K4BTDF
TE Connectivity Passive Product

RES SMD 15.4KOHM 0.1% 1/10W 0805

  • Resistance: 15.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고22,536
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A12K1BTDF
TE Connectivity Passive Product

RES SMD 12.1KOHM 0.1% 1/10W 0805

  • Resistance: 12.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고20,124
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A82R5BTDF
TE Connectivity Passive Product

RES SMD 82.5 OHM 0.1% 1/10W 0805

  • Resistance: 82.5 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,546
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K62BTDF
TE Connectivity Passive Product

RES SMD 1.62KOHM 0.1% 1/10W 0805

  • Resistance: 1.62 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고14,622
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A7K15BTDF
TE Connectivity Passive Product

RES SMD 7.15KOHM 0.1% 1/10W 0805

  • Resistance: 7.15 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고20,928
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A249RBTDF
TE Connectivity Passive Product

RES SMD 249 OHM 0.1% 1/10W 0805

  • Resistance: 249 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고23,328
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A66K5BTDF
TE Connectivity Passive Product

RES SMD 66.5KOHM 0.1% 1/10W 0805

  • Resistance: 66.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고18,900
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A665RBTDF
TE Connectivity Passive Product

RES SMD 665 OHM 0.1% 1/10W 0805

  • Resistance: 665 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고20,004
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A86K6BTDF
TE Connectivity Passive Product

RES SMD 86.6KOHM 0.1% 1/10W 0805

  • Resistance: 86.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,952
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A26K1BTDF
TE Connectivity Passive Product

RES SMD 26.1KOHM 0.1% 1/10W 0805

  • Resistance: 26.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고23,628
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A23K7BTDF
TE Connectivity Passive Product

RES SMD 23.7KOHM 0.1% 1/10W 0805

  • Resistance: 23.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고12,636
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K0BTDF
TE Connectivity Passive Product

RES SMD 1K OHM 0.1% 1/10W 0805

  • Resistance: 1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고12,804
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K5BTDF
TE Connectivity Passive Product

RES SMD 1.5K OHM 0.1% 1/10W 0805

  • Resistance: 1.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,280
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A10K7BTDF
TE Connectivity Passive Product

RES SMD 10.7KOHM 0.1% 1/10W 0805

  • Resistance: 10.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,086
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6K49BTDF
TE Connectivity Passive Product

RES SMD 6.49KOHM 0.1% 1/10W 0805

  • Resistance: 6.49 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고12,630
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A2K37BTDF
TE Connectivity Passive Product

RES SMD 2.37KOHM 0.1% 1/10W 0805

  • Resistance: 2.37 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,526
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A887RBTDF
TE Connectivity Passive Product

RES SMD 887 OHM 0.1% 1/10W 0805

  • Resistance: 887 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고23,544
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A255RBTDF
TE Connectivity Passive Product

RES SMD 255 OHM 0.1% 1/10W 0805

  • Resistance: 255 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고22,044
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A90K9BTDF
TE Connectivity Passive Product

RES SMD 90.9KOHM 0.1% 1/10W 0805

  • Resistance: 90.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고22,368
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A59KBTDF
TE Connectivity Passive Product

RES SMD 59K OHM 0.1% 1/10W 0805

  • Resistance: 59 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고20,820
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A221RBTDF
TE Connectivity Passive Product

RES SMD 221 OHM 0.1% 1/10W 0805

  • Resistance: 221 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고14,142
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A8K66BTDF
TE Connectivity Passive Product

RES SMD 8.66KOHM 0.1% 1/10W 0805

  • Resistance: 8.66 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고13,374
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-