페이지 96 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  96/546
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부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RN73C2A1K37BTDF
TE Connectivity Passive Product

RES SMD 1.37KOHM 0.1% 1/10W 0805

  • Resistance: 1.37 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고18,732
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A4K02BTDF
TE Connectivity Passive Product

RES SMD 4.02KOHM 0.1% 1/10W 0805

  • Resistance: 4.02 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,610
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K74BTDF
TE Connectivity Passive Product

RES SMD 1.74KOHM 0.1% 1/10W 0805

  • Resistance: 1.74 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,662
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6K04BTDF
TE Connectivity Passive Product

RES SMD 6.04KOHM 0.1% 1/10W 0805

  • Resistance: 6.04 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고12,420
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A3K92BTDF
TE Connectivity Passive Product

RES SMD 3.92KOHM 0.1% 1/10W 0805

  • Resistance: 3.92 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고18,348
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A11K3BTDF
TE Connectivity Passive Product

RES SMD 11.3KOHM 0.1% 1/10W 0805

  • Resistance: 11.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,610
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K33BTDF
TE Connectivity Passive Product

RES SMD 1.33KOHM 0.1% 1/10W 0805

  • Resistance: 1.33 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고14,376
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A2K55BTDF
TE Connectivity Passive Product

RES SMD 2.55KOHM 0.1% 1/10W 0805

  • Resistance: 2.55 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고22,728
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A26K7BTDF
TE Connectivity Passive Product

RES SMD 26.7KOHM 0.1% 1/10W 0805

  • Resistance: 26.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고13,206
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A22R1BTDF
TE Connectivity Passive Product

RES SMD 22.1 OHM 0.1% 1/10W 0805

  • Resistance: 22.1 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고22,788
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A97K6BTDF
TE Connectivity Passive Product

RES SMD 97.6KOHM 0.1% 1/10W 0805

  • Resistance: 97.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고19,272
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A9K53BTDF
TE Connectivity Passive Product

RES SMD 9.53KOHM 0.1% 1/10W 0805

  • Resistance: 9.53 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고14,772
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A12K4BTDF
TE Connectivity Passive Product

RES SMD 12.4KOHM 0.1% 1/10W 0805

  • Resistance: 12.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고18,156
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6K98BTDF
TE Connectivity Passive Product

RES SMD 6.98KOHM 0.1% 1/10W 0805

  • Resistance: 6.98 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고12,654
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A32K4BTDF
TE Connectivity Passive Product

RES SMD 32.4KOHM 0.1% 1/10W 0805

  • Resistance: 32.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고13,128
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A3K01BTDF
TE Connectivity Passive Product

RES SMD 3.01KOHM 0.1% 1/10W 0805

  • Resistance: 3.01 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고13,794
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A590RBTDF
TE Connectivity Passive Product

RES SMD 590 OHM 0.1% 1/10W 0805

  • Resistance: 590 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,452
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A60K4BTDF
TE Connectivity Passive Product

RES SMD 60.4KOHM 0.1% 1/10W 0805

  • Resistance: 60.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고21,432
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A22K6BTDF
TE Connectivity Passive Product

RES SMD 22.6KOHM 0.1% 1/10W 0805

  • Resistance: 22.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고18,348
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A976RBTDF
TE Connectivity Passive Product

RES SMD 976 OHM 0.1% 1/10W 0805

  • Resistance: 976 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고14,640
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6K34BTDF
TE Connectivity Passive Product

RES SMD 6.34KOHM 0.1% 1/10W 0805

  • Resistance: 6.34 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,974
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A365RBTDF
TE Connectivity Passive Product

RES SMD 365 OHM 0.1% 1/10W 0805

  • Resistance: 365 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고22,476
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A30K9BTDF
TE Connectivity Passive Product

RES SMD 30.9KOHM 0.1% 1/10W 0805

  • Resistance: 30.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고12,318
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A316RBTDF
TE Connectivity Passive Product

RES SMD 316 OHM 0.1% 1/10W 0805

  • Resistance: 316 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고14,694
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A38K3BTDF
TE Connectivity Passive Product

RES SMD 38.3KOHM 0.1% 1/10W 0805

  • Resistance: 38.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고21,636
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K58BTDF
TE Connectivity Passive Product

RES SMD 1.58KOHM 0.1% 1/10W 0805

  • Resistance: 1.58 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고20,316
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A9K76BTDF
TE Connectivity Passive Product

RES SMD 9.76KOHM 0.1% 1/10W 0805

  • Resistance: 9.76 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고21,492
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A15K8BTDF
TE Connectivity Passive Product

RES SMD 15.8KOHM 0.1% 1/10W 0805

  • Resistance: 15.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고21,432
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-