XMOS 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
XUF232-1024-FB324-C40	XMOS	IC MCU 32BIT 2MB FLASH 324FBGA Core Processor: XCore Core Size: 32-Bit 32-Core Speed: 4000MIPS Connectivity: USB Peripherals: - Number of I/O: 208 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (15x15)	패키지: 324-FBGA	재고4,928
XUF224-512-FB324-I40	XMOS	IC MCU 32BIT 2MB FLASH 324FBGA Core Processor: XCore Core Size: 32-Bit 24-Core Speed: 4000MIPS Connectivity: USB Peripherals: - Number of I/O: 208 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (15x15)	패키지: 324-FBGA	재고2,848
XS1-A8A-128-FB217-C10	XMOS	IC MCU 32BIT 128KB SRAM 217FBGA Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 1000MIPS Connectivity: Configurable Peripherals: - Number of I/O: 90 Program Memory Size: 128KB (32K x 32) Program Memory Type: SRAM EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 0.90 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 217-LFBGA Supplier Device Package: 217-FBGA (16x16)	패키지: 217-LFBGA	재고3,008
XS1-A8A-128-FB217-I8	XMOS	IC MCU 32BIT 128KB SRAM 217FBGA Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 800MIPS Connectivity: Configurable Peripherals: - Number of I/O: 90 Program Memory Size: 128KB (32K x 32) Program Memory Type: SRAM EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 0.90 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 217-LFBGA Supplier Device Package: 217-FBGA (16x16)	패키지: 217-LFBGA	재고4,832
XS1-U8A-128-FB217-C10	XMOS	IC MCU 32BIT 128KB SRAM WAFER Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 1000MIPS Connectivity: Configurable Peripherals: - Number of I/O: 73 Program Memory Size: 128KB (32K x 32) Program Memory Type: SRAM EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 217-LFBGA Supplier Device Package: Wafer	패키지: 217-LFBGA	재고7,600
XS1-U8A-64-FB96-I5	XMOS	IC MCU 32BIT 64KB SRAM 96FBGA Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 500MIPS Connectivity: Configurable Peripherals: - Number of I/O: 38 Program Memory Size: 64KB (16K x 32) Program Memory Type: SRAM EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 4x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 96-LFBGA Supplier Device Package: 96-FBGA (10x10)	패키지: 96-LFBGA	재고7,328
XUF216-256-FB236-I20	XMOS	IC MCU 32BIT 2MB FLASH 236FBGA Core Processor: XCore Core Size: 32-Bit 16-Core Speed: 2000MIPS Connectivity: USB Peripherals: - Number of I/O: 104 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: 236-LFBGA	재고3,136
XLF210-256-TQ128-I20	XMOS	IC MCU 32BIT 2MB FLASH 128TQFP Core Processor: XCore Core Size: 32-Bit 10-Core Speed: 2000MIPS Connectivity: - Peripherals: - Number of I/O: 88 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 128-TQFP Exposed Pad Supplier Device Package: 128-TQFP (14x14)	패키지: 128-TQFP Exposed Pad	재고4,272
XLF212-256-FB236-C20	XMOS	IC MCU 32BIT 2MB FLASH 236FBGA Core Processor: XCore Core Size: 32-Bit 12-Core Speed: 2000MIPS Connectivity: - Peripherals: - Number of I/O: 128 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: 236-LFBGA	재고6,432
XL216-256-TQ128-C20	XMOS	IC MCU 32BIT ROMLESS 128TQFP Core Processor: XCore Core Size: 32-Bit 16-Core Speed: 2000MIPS Connectivity: - Peripherals: - Number of I/O: 88 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 128-TQFP Exposed Pad Supplier Device Package: 128-TQFP (14x14)	패키지: 128-TQFP Exposed Pad	재고2,240
XS1-L01A-TQ48-C5-THS	XMOS	IC MCU 32BIT 64KB SRAM 48TQFP Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 500MIPS Connectivity: Configurable Peripherals: - Number of I/O: 28 Program Memory Size: 64KB (16K x 32) Program Memory Type: SRAM EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 48-TQFP Exposed Pad Supplier Device Package: 48-TQFP (7x7)	패키지: 48-TQFP Exposed Pad	재고6,592
XLF208-128-FB236-C10	XMOS	IC MCU 32BIT 1MB FLASH 236FBGA Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 1000MIPS Connectivity: - Peripherals: - Number of I/O: 128 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: 236-LFBGA	재고2,100
XLF208-128-TQ64-I10	XMOS	IC MCU 32BIT 1MB FLASH 64TQFP Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 1000MIPS Connectivity: - Peripherals: - Number of I/O: 42 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-TQFP (10x10)	패키지: 64-TQFP Exposed Pad	재고4,896
XL208-256-FB236-C10	XMOS	IC MCU 32BIT ROMLESS 236FBGA Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 1000MIPS Connectivity: - Peripherals: - Number of I/O: 128 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: 236-LFBGA	재고4,112
XUF208-128-QF48-I10	XMOS	IC MCU 32BIT 1MB FLASH 48UQFN Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 1000MIPS Connectivity: USB Peripherals: - Number of I/O: 27 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-UFQFN Exposed Pad Supplier Device Package: 48-UQFN (6x6)	패키지: 48-UFQFN Exposed Pad	재고2,528
XUF208-128-QF48-C10	XMOS	IC MCU 32BIT 1MB FLASH 48UQFN Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 1000MIPS Connectivity: USB Peripherals: - Number of I/O: 27 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 48-UFQFN Exposed Pad Supplier Device Package: 48-UQFN (6x6)	패키지: 48-UFQFN Exposed Pad	재고5,072
XU216-256-TQ128-C20	XMOS	IC MCU 32BIT ROMLESS 128TQFP Core Processor: XCore Core Size: 32-Bit 16-Core Speed: 2000MIPS Connectivity: USB Peripherals: - Number of I/O: 81 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 128-TQFP Exposed Pad Supplier Device Package: 128-TQFP (14x14)	패키지: 128-TQFP Exposed Pad	재고6,468
XS1-U16A-128-FB217-C10	XMOS	IC MCU 32BIT 128KB SRAM 217FBGA Core Processor: XCore Core Size: 32-Bit 16-Core Speed: 1000MIPS Connectivity: Configurable Peripherals: - Number of I/O: 73 Program Memory Size: 128KB (32K x 32) Program Memory Type: SRAM EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 217-LFBGA Supplier Device Package: 217-FBGA (16x16)	패키지: 217-LFBGA	재고6,228
XS1-L8A-64-LQ64-C5	XMOS	IC MCU 32BIT 64KB SRAM 64LQFP Core Processor: XCore Core Size: 32-Bit 8-Core Speed: 500MIPS Connectivity: Configurable Peripherals: - Number of I/O: 36 Program Memory Size: 64KB (16K x 32) Program Memory Type: SRAM EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP Exposed Pad	재고6,880
XLF216-256-FB236-I20A	XMOS	IC MCU 32BIT 2MB FLASH 236FBGA Core Processor: XCore Core Size: 32-Bit 16-Core Speed: 2000MIPs Connectivity: - Peripherals: - Number of I/O: 128 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: -	Request a Quote
XUF224-1024-FB374-C40A	XMOS	IC MCU 32BIT 2MB FLASH 374FBGA Core Processor: XCore Core Size: 32-Bit 24-Core Speed: 2000MIPs Connectivity: USB Peripherals: - Number of I/O: 176 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 374-LFBGA Supplier Device Package: 374-FBGA (18x18)	패키지: -	Request a Quote
XUF210-256-FB236-C20A	XMOS	IC MCU 32BIT 2MB FLASH 236FBGA Core Processor: XCore Core Size: 32-Bit 10-Core Speed: 1000MIPs Connectivity: USB Peripherals: - Number of I/O: 128 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: -	Request a Quote
XLF232-512-FB374-I40A	XMOS	IC MCU 32BIT 2MB FLASH 374FBGA Core Processor: XCore Core Size: 32-Bit 32-Core Speed: 2000MIPs Connectivity: - Peripherals: - Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 374-LFBGA Supplier Device Package: 374-FBGA (18x18)	패키지: -	Request a Quote
XUF224-512-FB374-C40A	XMOS	IC MCU 32BIT 2MB FLASH 374FBGA Core Processor: XCore Core Size: 32-Bit 24-Core Speed: 2000MIPs Connectivity: USB Peripherals: - Number of I/O: 176 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 374-LFBGA Supplier Device Package: 374-FBGA (18x18)	패키지: -	Request a Quote
XUF212-512-FB236-C20A	XMOS	IC MCU 32BIT 2MB FLASH 236FBGA Core Processor: XCore Core Size: 32-Bit 12-Core Speed: 1000MIPs Connectivity: USB Peripherals: - Number of I/O: 128 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: -	Request a Quote
XUF232-512-FB374-C40A	XMOS	IC MCU 32BIT 2MB FLASH 374FBGA Core Processor: XCore Core Size: 32-Bit 32-Core Speed: 2000MIPs Connectivity: USB Peripherals: - Number of I/O: 176 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 374-LFBGA Supplier Device Package: 374-FBGA (18x18)	패키지: -	Request a Quote
XLF210-256-TQ128-C20A	XMOS	IC MCU 32BIT 2MB FLASH 128TQFP Core Processor: XCore Core Size: 32-Bit 10-Core Speed: 1000MIPs Connectivity: - Peripherals: - Number of I/O: 88 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 128-TQFP Exposed Pad Supplier Device Package: 128-TQFP (14x14)	패키지: -	Request a Quote
XLF210-512-FB236-I20A	XMOS	IC MCU 32BIT 2MB FLASH 236FBGA Core Processor: XCore Core Size: 32-Bit 10-Core Speed: 2000MIPs Connectivity: - Peripherals: - Number of I/O: 128 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 236-LFBGA Supplier Device Package: 236-FBGA (10x10)	패키지: -	Request a Quote

XUF232-1024-FB324-C40

XMOS

IC MCU 32BIT 2MB FLASH 324FBGA

Core Processor: XCore
Core Size: 32-Bit 32-Core
Speed: 4000MIPS
Connectivity: USB
Peripherals: -
Number of I/O: 208
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 324-FBGA
Supplier Device Package: 324-FBGA (15x15)

패키지: 324-FBGA

재고4,928

XUF224-512-FB324-I40

XMOS

IC MCU 32BIT 2MB FLASH 324FBGA

Core Processor: XCore
Core Size: 32-Bit 24-Core
Speed: 4000MIPS
Connectivity: USB
Peripherals: -
Number of I/O: 208
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 324-FBGA
Supplier Device Package: 324-FBGA (15x15)

패키지: 324-FBGA

재고2,848

XS1-A8A-128-FB217-C10

XMOS

IC MCU 32BIT 128KB SRAM 217FBGA

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 1000MIPS
Connectivity: Configurable
Peripherals: -
Number of I/O: 90
Program Memory Size: 128KB (32K x 32)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 0.90 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 217-LFBGA
Supplier Device Package: 217-FBGA (16x16)

패키지: 217-LFBGA

재고3,008

XS1-A8A-128-FB217-I8

XMOS

IC MCU 32BIT 128KB SRAM 217FBGA

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 800MIPS
Connectivity: Configurable
Peripherals: -
Number of I/O: 90
Program Memory Size: 128KB (32K x 32)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 0.90 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 217-LFBGA
Supplier Device Package: 217-FBGA (16x16)

패키지: 217-LFBGA

재고4,832

XS1-U8A-128-FB217-C10

XMOS

IC MCU 32BIT 128KB SRAM WAFER

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 1000MIPS
Connectivity: Configurable
Peripherals: -
Number of I/O: 73
Program Memory Size: 128KB (32K x 32)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 217-LFBGA
Supplier Device Package: Wafer

패키지: 217-LFBGA

재고7,600

XS1-U8A-64-FB96-I5

XMOS

IC MCU 32BIT 64KB SRAM 96FBGA

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 500MIPS
Connectivity: Configurable
Peripherals: -
Number of I/O: 38
Program Memory Size: 64KB (16K x 32)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 4x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 96-LFBGA
Supplier Device Package: 96-FBGA (10x10)

패키지: 96-LFBGA

재고7,328

XUF216-256-FB236-I20

XMOS

IC MCU 32BIT 2MB FLASH 236FBGA

Core Processor: XCore
Core Size: 32-Bit 16-Core
Speed: 2000MIPS
Connectivity: USB
Peripherals: -
Number of I/O: 104
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: 236-LFBGA

재고3,136

XLF210-256-TQ128-I20

XMOS

IC MCU 32BIT 2MB FLASH 128TQFP

Core Processor: XCore
Core Size: 32-Bit 10-Core
Speed: 2000MIPS
Connectivity: -
Peripherals: -
Number of I/O: 88
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 128-TQFP Exposed Pad
Supplier Device Package: 128-TQFP (14x14)

패키지: 128-TQFP Exposed Pad

재고4,272

XLF212-256-FB236-C20

XMOS

IC MCU 32BIT 2MB FLASH 236FBGA

Core Processor: XCore
Core Size: 32-Bit 12-Core
Speed: 2000MIPS
Connectivity: -
Peripherals: -
Number of I/O: 128
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: 236-LFBGA

재고6,432

XL216-256-TQ128-C20

XMOS

IC MCU 32BIT ROMLESS 128TQFP

Core Processor: XCore
Core Size: 32-Bit 16-Core
Speed: 2000MIPS
Connectivity: -
Peripherals: -
Number of I/O: 88
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 128-TQFP Exposed Pad
Supplier Device Package: 128-TQFP (14x14)

패키지: 128-TQFP Exposed Pad

재고2,240

XS1-L01A-TQ48-C5-THS

XMOS

IC MCU 32BIT 64KB SRAM 48TQFP

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 500MIPS
Connectivity: Configurable
Peripherals: -
Number of I/O: 28
Program Memory Size: 64KB (16K x 32)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 48-TQFP Exposed Pad
Supplier Device Package: 48-TQFP (7x7)

패키지: 48-TQFP Exposed Pad

재고6,592

XLF208-128-FB236-C10

XMOS

IC MCU 32BIT 1MB FLASH 236FBGA

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 1000MIPS
Connectivity: -
Peripherals: -
Number of I/O: 128
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: 236-LFBGA

재고2,100

XLF208-128-TQ64-I10

XMOS

IC MCU 32BIT 1MB FLASH 64TQFP

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 1000MIPS
Connectivity: -
Peripherals: -
Number of I/O: 42
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-TQFP (10x10)

패키지: 64-TQFP Exposed Pad

재고4,896

XL208-256-FB236-C10

XMOS

IC MCU 32BIT ROMLESS 236FBGA

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 1000MIPS
Connectivity: -
Peripherals: -
Number of I/O: 128
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: 236-LFBGA

재고4,112

XUF208-128-QF48-I10

XMOS

IC MCU 32BIT 1MB FLASH 48UQFN

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 1000MIPS
Connectivity: USB
Peripherals: -
Number of I/O: 27
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-UFQFN Exposed Pad
Supplier Device Package: 48-UQFN (6x6)

패키지: 48-UFQFN Exposed Pad

재고2,528

XUF208-128-QF48-C10

XMOS

IC MCU 32BIT 1MB FLASH 48UQFN

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 1000MIPS
Connectivity: USB
Peripherals: -
Number of I/O: 27
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 48-UFQFN Exposed Pad
Supplier Device Package: 48-UQFN (6x6)

패키지: 48-UFQFN Exposed Pad

재고5,072

XU216-256-TQ128-C20

XMOS

IC MCU 32BIT ROMLESS 128TQFP

Core Processor: XCore
Core Size: 32-Bit 16-Core
Speed: 2000MIPS
Connectivity: USB
Peripherals: -
Number of I/O: 81
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 128-TQFP Exposed Pad
Supplier Device Package: 128-TQFP (14x14)

패키지: 128-TQFP Exposed Pad

재고6,468

XS1-U16A-128-FB217-C10

XMOS

IC MCU 32BIT 128KB SRAM 217FBGA

Core Processor: XCore
Core Size: 32-Bit 16-Core
Speed: 1000MIPS
Connectivity: Configurable
Peripherals: -
Number of I/O: 73
Program Memory Size: 128KB (32K x 32)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 217-LFBGA
Supplier Device Package: 217-FBGA (16x16)

패키지: 217-LFBGA

재고6,228

XS1-L8A-64-LQ64-C5

XMOS

IC MCU 32BIT 64KB SRAM 64LQFP

Core Processor: XCore
Core Size: 32-Bit 8-Core
Speed: 500MIPS
Connectivity: Configurable
Peripherals: -
Number of I/O: 36
Program Memory Size: 64KB (16K x 32)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 0.95 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP Exposed Pad

재고6,880

XLF216-256-FB236-I20A

XMOS

IC MCU 32BIT 2MB FLASH 236FBGA

Core Processor: XCore
Core Size: 32-Bit 16-Core
Speed: 2000MIPs
Connectivity: -
Peripherals: -
Number of I/O: 128
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: -

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XUF224-1024-FB374-C40A

XMOS

IC MCU 32BIT 2MB FLASH 374FBGA

Core Processor: XCore
Core Size: 32-Bit 24-Core
Speed: 2000MIPs
Connectivity: USB
Peripherals: -
Number of I/O: 176
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 374-LFBGA
Supplier Device Package: 374-FBGA (18x18)

패키지: -

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XUF210-256-FB236-C20A

XMOS

IC MCU 32BIT 2MB FLASH 236FBGA

Core Processor: XCore
Core Size: 32-Bit 10-Core
Speed: 1000MIPs
Connectivity: USB
Peripherals: -
Number of I/O: 128
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: -

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XLF232-512-FB374-I40A

XMOS

IC MCU 32BIT 2MB FLASH 374FBGA

Core Processor: XCore
Core Size: 32-Bit 32-Core
Speed: 2000MIPs
Connectivity: -
Peripherals: -
Number of I/O: 256
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 374-LFBGA
Supplier Device Package: 374-FBGA (18x18)

패키지: -

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XUF224-512-FB374-C40A

XMOS

IC MCU 32BIT 2MB FLASH 374FBGA

Core Processor: XCore
Core Size: 32-Bit 24-Core
Speed: 2000MIPs
Connectivity: USB
Peripherals: -
Number of I/O: 176
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 374-LFBGA
Supplier Device Package: 374-FBGA (18x18)

패키지: -

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XUF212-512-FB236-C20A

XMOS

IC MCU 32BIT 2MB FLASH 236FBGA

Core Processor: XCore
Core Size: 32-Bit 12-Core
Speed: 1000MIPs
Connectivity: USB
Peripherals: -
Number of I/O: 128
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: -

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XUF232-512-FB374-C40A

XMOS

IC MCU 32BIT 2MB FLASH 374FBGA

Core Processor: XCore
Core Size: 32-Bit 32-Core
Speed: 2000MIPs
Connectivity: USB
Peripherals: -
Number of I/O: 176
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 374-LFBGA
Supplier Device Package: 374-FBGA (18x18)

패키지: -

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XLF210-256-TQ128-C20A

XMOS

IC MCU 32BIT 2MB FLASH 128TQFP

Core Processor: XCore
Core Size: 32-Bit 10-Core
Speed: 1000MIPs
Connectivity: -
Peripherals: -
Number of I/O: 88
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 128-TQFP Exposed Pad
Supplier Device Package: 128-TQFP (14x14)

패키지: -

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XLF210-512-FB236-I20A

XMOS

IC MCU 32BIT 2MB FLASH 236FBGA

Core Processor: XCore
Core Size: 32-Bit 10-Core
Speed: 2000MIPs
Connectivity: -
Peripherals: -
Number of I/O: 128
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 236-LFBGA
Supplier Device Package: 236-FBGA (10x10)

패키지: -

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