Melexis has announced the introduction of a unique plug and play magnetic switch, MLX92362, which improves the assembly yield and reliability of liquid level measurements. The MLX92362 uses isolated floating output to drive the load directly with only power on. The operating temperature range of the switch is -40℃ to 150℃.
EDIFIER Lolli3 true Wireless Bluetooth headset and MiniBuds2 true wireless Bluetooth headset have been released. Snapdragon Sound™ Snapdragon Audio Is a powerful Bluetooth connection that delivers high quality audio, full link low latency optimization, professional call noise reduction technology and smooth transmission performance. Bring users a full range of listening experience.
U-blox now offers sarA-R510 AWS modules, a new variant of the globally certified SARA-R5 LTE-M family of cellular modules. The module performs a variety of applications that require reliable and secure cloud connectivity in industries such as asset tracking, sensor monitoring, smart agriculture and connected medical devices.
Integrate the security unit based on the industry standard certified ST33K-A security chip and the Java® Card platform, as well as the G+D Digital Key® applet, to provide a system-on-a-chip solution for the development of a secure car entry system, improving the convenience and safety of the car , in line with the latest digital car key standards of the Internet of Vehicles Consortium (CCC)
Texas Instruments (TI) has introduced a new line of solid state relays, including automotive standard isolated drives and switches, that offer industry-outstanding reliability and help improve the safety of electric vehicles (EVs). The new product line helps improve the safety of electric vehicles while reducing solution sizes by up to 90 percent and costs by up to 50 percent
ON Semiconductor launched the world's first TOLL packaged 650 V SiC MOSFET. New device shrinks package size by 60%, enhances performance and reduces losses
Microchip launches a new real-time platform Trust root to provide a complete chain of Trust for system platforms. The Microchip Trust Shield family of products is designed to provide end-to-end solutions to protect data centers, telecommunications and network systems from rapidly evolving security threats
The new qSmartAI80_CUQ610 AI Vision Kit from e-con Systems in partnership with Qualcomm provides a complete AI vision and analytics solution for a wide range of vision applications. This vision kit uses a Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module to provide superior visual quality. The kit can process images locally without connecting to any cloud server. Additionally, it is capable of running ML/DL models for visual data. Therefore, this kit is the perfect and reliable solution for various AI vision applications.
ST's STNRG012 is a highly integrated and space-saving digital power controller with advanced distortion suppression, ideal for developing LED lighting applications
STPOWER MDmesh M9 and DM9 silicon-based N-channel superjunction multidrain power MOSFET transistors are ideal for designing switching power supplies (SMPS) for data center servers, 5G infrastructure, and flat panel TVS. The first two devices available are the 650V STP65N045M9 and the 600V STP60N043DM9.
GROMACS is accelerated with Intel's oneAPI open programming and multi-architecture tools, and runs on Intel Xe architecture-based GPUs for exceptional performance.
NXP Semiconductors N.V. announced that the Xiaomi Redmi Note 10T smartphone features NXP's SN110 converged eSIM solution. The SN110 offers a high level of security availability, including CC EAL6+ security certification following the GSMA CC Protection Profile, GP (Global platform) and GSMA certification schemes.
Infineon Technologies AG has released a new CoolSiC™ technology, the CoolSiC™ MOSFET 1200 V M1H. This advanced silicon carbide (SiC) chip is used in the popular Easy module family, as well as in discrete packages based on .XT interconnect technology, with a very broad product portfolio.
Infineon Technologies inc. has introduced CIPOS Tiny IM323-L6G 600 V 15 A to further expand its LINEUP of CIPOS™ Tiny Intelligent Power Modules (IPM). The new IPM uses TRENCHSTOP™ RC-D2 IGBT power switches and advanced SOI gate drive technology to maximize efficiency and reliability while minimizing the size and cost of the system.
TouchNetix announced the launch of a fully integrated aXiom touch screen chip that delivers new 3D sensing capabilities by detecting air gestures, enabling contactless functionality in a variety of automotive, industrial and consumer environments.
Allegro MicroSystems, a global leader in motion control and energy efficient system sensing technology and power semiconductor solutions, has announced that it has shipped its 3 billionth motor driver chip, a testament to Allegro's strength in the motion control business. Allegro's trusted and highly reliable motor drivers have helped customers around the world develop safer, more powerful and reliable motor drive solutions for electric vehicles, data center servers, cordless power tools and other products in automotive, industrial and consumer applications.
STMicroelectronics 40V MOSFET transistors STL320N4LF8 and STL325N4LF8AG reduce on-resistance and switching losses while optimizing body parasitic diode characteristics to reduce energy consumption and noise in power conversion, motor control and power distribution circuits.
Molex, a global electronics industry leader and connectivity innovator, announces the commercial availability of Molex’s Quad-Row board-to-board connectors, featuring an industry-first interleaved circuit layout that saves 30% space over traditional connector designs .
