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최신 기술

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Technology Cover

2022-06-24, ROHM develops "RFL/RFS series" of fast recovery diodes with low loss performance and ultra-low noise characteristics

ROHM has developed the fourth-generation fast recovery diode "RFL/RFS series" that realizes low loss performance and ultra-low noise characteristics, contributing to improving power efficiency of air conditioners, electric vehicle charging points, etc. and contributing to noise reduction measures

Technology Cover

2022-06-24, Microchip Simplifies Automotive Design with ISO 26262-Compliant AUTOSAR-Ready Devices and Ecosystem

Microchip introduces ISO 26262 compliant, AUTOSAR-ready devices and ecosystem to simplify automotive design. New dsPIC33C Digital Signal Controller (DSC) adds support for AUTOSAR, OS, MCAL driver and functional safety for robust and secure automotive solutions Program

Technology Cover

2022-06-24, Swissbit G-20 Industrial Grade CFexpress Card Now Available

The new G-20 product line from Swissbit includes several CFexpress 2.0 Type B memory cards, which are considered the high-performance successor to the CFast standard. The product is suitable for a wide range of applications, such as industrial automation, gaming, transportation, medical technology, and applications where thermal management is critical.

Technology Cover

2022-06-24, Infineon launches the world's first high-resolution automotive 3D image sensor compliant with ISO26262

Infineon Technologies AG has partnered with pmd, which specializes in 3D ToF (time-of-flight) systems, to develop the second-generation automotive REAL3™ image sensor, which is ISO26262 compliant and has higher resolution . Housed in a 9 x 9 mm² plastic BGA (Ball Grid Array) package, the sensor achieves a VGA system resolution of 640 x 480 pixels using a tiny photosensitive area of only 4 mm.

Technology Cover

2022-06-23, Silicon Labs Announces New Bluetooth® Location Services with Advanced Hardware and Software

Silicon Labs announces a new Bluetooth® location service with advanced hardware and software. Borda Technology uses this new solution to track hospital equipment for more efficient care

Technology Cover

2022-06-23, Diodes Introduces Adjustable Multiplexing/Demultiplexing Linear ReDriver

Diodes Introduces Adjustable Multiplexing/Demultiplexing Linear ReDriver that Routes at 20Gbps DisplayPort Data Rates

Technology Cover

2022-06-23, Analog Devices' Low-Jitter Frequency Synthesizer Enables GSPS Data Converter Solutions for Superior Performance

Analog Devices, Inc. (ADI) introduces the ADF4377, an 800MHz to 12.8GHz frequency synthesizer for high-performance ultra-wideband data converters and synchronization applications. Ideal for applications that require multiple data converters or mixed-signal front-end (MxFE) digitizers to work together, such as radar, instrumentation, wideband receivers, etc.

Technology Cover

2022-06-23, Microchip Introduces New 8-Bit MCU Development Board to Connect to 5G LTE-M Narrowband IoT Networks

Microchip Introduces New 8-Bit MCU Development Board to Connect to 5G LTE-M Narrowband IoT Networks.The AVR-IoT Cellular Mini Development Board, the latest addition to Microchip's AVR® family, provides developers with an easy blueprint for building IoT devices

Technology Cover

2022-06-23, New Unified Qualcomm AI Software Stack Portfolio Transforms Developer Access

The new unified Qualcomm AI software stack product portfolio changes the way developers access, expands the company's AI leadership in the intelligent network edge field, and the complete AI product portfolio works with Qualcomm Technologies' products at different levels to provide OEM manufacturers and developers. Bring advanced AI solutions and increase efficiency

Technology Cover

2022-06-23, Nexperia Introduces New Level Shifters to Support Legacy and Future Mobile SIMs

Nexperia Introduces New Level Shifter to Support Legacy and Future Cell Phone SIM Cards. Low Operating Current and Low Shutdown Current Helps Maximize Cell Phone Battery Life

Technology Cover

2022-06-22, Renesas Electronics Introduces Highly Integrated Advanced Bluetooth Low Energy Wireless System-on-Chip

Renesas' New SmartBond DA1470x Product Family Brings Integrated Applications and 2D Graphics Processor, Voice Activity Detector, and Power Management in Small Form Factors for Smaller Form Factor IoT Product Designs

Technology Cover

2022-06-22, Mouser Electronics Introduces Qorvo QPF4532 Integrated Front-End Module for Wi-Fi 6 Designs

The Qorvo QPF4532 FEM, available from Mouser Electronics, integrates a 5.0 GHz power amplifier (PA), single pole double throw (SP2T) switch and bypassable low noise amplifier (LNA) in a single device. The compact form factor and integrated matching of the QPF4532 can effectively reduce its footprint in the application. The device optimizes the power amplifier for a 3.3 V supply voltage, reducing power consumption while maintaining high linear output power and excellent throughput.

Technology Cover

2022-06-22, ON Semiconductor's Rich SiC Solutions Solve the Design Challenges of Next-Generation UPS

ON Semiconductor is in a leading position in the SiC field and is one of the few suppliers in the world that can provide end-to-end SiC solutions from substrate to module, providing UPS with high energy efficiency, high performance SiC MOSFETs, SiC diodes, All SiC modules and hybrid SiC modules, together with ON Semiconductor's SiC-optimized gate drivers, sensing, isolation and protection ICs and other peripheral devices and application support, help designers to make the difference between performance, energy efficiency, size, cost, and control difficulty. Find the best trade-offs.

Technology Cover

2022-06-22, Melexis redefines the market with new 3D magnetic position sensor chips

Announced the launch of the MLX9042x family, a new addition to its 3D magnetic position sensing solution. Designed for cost-conscious automotive customers, this family of sensor chips can accurately and safely measure absolute position in harsh, noisy environments and over a wider temperature range. And the latest rotary and linear positioning devices focus on advanced features, providing cost-effective solutions

Technology Cover

2022-06-22, NXP launches 4-channel dual-polarization analog beamformer to effectively improve 5G mmWave reliability

NXP has launched a 4-channel dual-polarization analog beamformer to effectively improve the reliability of 5G mmWave. New 4-Channel Dual-Polarization Analog Beamformers MMW9012K and MMW9014K Improve 5G mmWave Beam Steering Accuracy to Improve System Reliability

Technology Cover

2022-06-22, Teledyne e2v: Immediately improves dynamic performance of wideband ADCs by ~10 dBFS with spurious suppression IP

The new EV12AQ600/605-ADX4 device options have an integrated ADX4 license key to improve dynamic performance at peak operation up to 6.4 GS/s (single-channel mode). ADX4 - Xilinx Kintex® Ultrascale FPGA-compatible post-processing algorithm provides up to 10 dBFS of SFDR dynamic spurious suppression and close to 1 significant bit of additional resolution in wideband applications.

Technology Cover

2022-06-21, TVS in SMC provide high power density with low clamping ratio for industry

Vishay Intertechnology has released three new 24V surface mount XClampR TVs offering high peak pulse power consumption equivalent to 7kW of conventional TVs, 10/1000µs for SMC (DO-214AB) package and 10/10,000µs for DO-218AB .

Technology Cover

2022-06-21, Easy to configure and efficient digital 40A PoL

The Flex Power Module offers its BMR473 digital PoL converter packaged in a space-saving SIP or horizontal mount format. A PMBus interface is provided, allowing monitoring and configuration, including input overvoltage and undervoltage protection thresholds and output overcurrent limits. The SIP version of the device is only 26.3mm × 8.8mm × 15.6mm, and the board area occupied is less than 2.3cm.