NXP Semiconductor announced the launch of the new S32K39 family of Automotive Microcontrollers (MCUS) optimized for electric vehicle (EV) control applications. The high-speed, high-resolution control of the new generation of S32K39 MCU improves energy efficiency and provides a smoother EV driving experience while extending driving range to meet future electrification needs
The PTN3222 is a 1-port USB2 to USB2 redriver IC that performs the conversion between eUSB2 and USB2 signaling schemes. It is used in a system with eUSB2 where one side is USB2 interface and the other side is USB2 interface. Support for host repeater, device repeater or dual role repeater function.
The PCA9685 is an I2C-bus controlled 16-channel LED controller optimized for Red/Green/Blue/Amber (RGBA) color backlighting applications. Each LED output has its own 12-bit resolution (4096 steps) fixed frequency individual PWM controller that operates at a programmable frequency from a typical of 24 Hz to 1526 Hz with a duty cycle that is adjustable from 0 % to 100 % to allow the LED to be set to a specific brightness value.All outputs are set to the same PWM frequency.
NXP Semiconductors offers the OrangeBox automotive-grade development platform, which combines various NXP wireless technologies, from broadcast radio, Wi-Fi 6 and Bluetooth, to secure car access with UWB and BLE, and 802.11p-based V2X. The platform is a single, security-enhanced, modular development solution offering a unified interface between the vehicle’s gateway and wired and wireless technologies
NXP Semiconductor has announced that the second generation of its RFCMOS radar transceiver family has entered production. The TEF82xx is optimized for fast chirp modulation to support short, medium, and long range radar applications, including cascaded high-resolution imaging radars. The device supports 360-degree sensing and safety-critical applications, including automatic emergency braking, adaptive cruise control, blind spot monitoring, lateral traffic warning, and automatic parking
The NXP Semiconductors TEA2093TS GreenChip synchronous rectifier is a dedicated controller IC that performs synchronous rectification on the secondary side of both asymmetric and standard flyback converters. The TEA2093TS uses adaptive gate drive to achieve maximum efficiency under any load.
NXP Semiconductors now offers its new higher power BTS7202 RX FEM and BTS6403/6305 pre-drivers for 5G massive MIMO going up to 20W per channel. Developed and implemented in its SiGe process, the devices function with modest current consumption to lower operational costs for MNOs. They also provide improved linearity and lower noise figures to support better 5G signal quality.
NXP Semiconductors announced the launch of the new higher power BTS7202 RF front-end receiver module (FEM) and BTS6403/6305 pre-driver amplifiers to support the construction of 5G massive multiple-input multiple-output (MIMO) base stations with power up to 20W per channel. The new BTS7202 RF front-end receiving module and BTS6403/6305 pre-driver amplifier improve 5G call quality and network speed with higher output power, linearity and lower noise figure
NXP's USB Type-C CC provides an intelligent low-current source anti-corrosion solution, the NX20P0477 is a single-chip USB-c (USB-c) port overvoltage protection solution that integrates a moisture-proof and anti-corrosion algorithm. On the system side CC1 and CC2 pins are protected from 28 V short to V (bus). Available in 0.5 mm pitch, nine bumps, and 1.49 mm x 1.49 mm x 0.555 mm WLCSP packages.
NXP Introduces First Automotive-Grade Security Chip with NFC and Wired Interface for Keyless Entry Smart Key Fobs and Multiple Security Applications Helps Improve the Security of Smart Connected Cars
The NXP Semiconductors TEA2093TS GreenChip Synchronous rectifier controller is a dedicated controller IC for synchronous rectifier on the secondary side of asymmetric half-bridge flyback and standard flyback converters
The high-throughput manufacturing specialist in basic semiconductor devices today announced the expansion of its portfolio of ultra-low clamp and ultra-low capacitance ESD protection diodes. The product portfolio is designed to protect high-speed data cables such as USB 3.2, HDMI 2.0, LVDS, automotive A/V monitors, displays and cameras. In addition, the portfolio is designed to address future high-speed video links and open technology Alliance MGbit Ethernet applications.
Nexperia announces PMCB60XN and PMCB60XNE 30V N-Channel Small Signal Trench MOSFETs in an ultra-compact wafer-level DSN1006 package with market-leading RDS(on) characteristics where space is constrained and battery life is critical , which can make the power more durable.
"As smartphones become more feature-rich, the form factor has become a differentiating feature for consumers," said Honor CEO George Zhao. "NXP's FEM solution allows us to overcome the growing complexity and challenges of flagship mobile phone design, while still delivering longer range and improved Wi-Fi 6 signal quality."
Nexperia, a specialist in high-throughput production of basic semiconductor devices, announces a new series of 20 V and 30 V MOSFETs DFN0603 in an ultra-small DFN package.
NXP collaborates with ING and Samsung on the industry's first UWB-based peer-to-peer payment application pilot, based on NXP's ultra-wideband technology and ING's professional payment technology, the pilot aims to make peer-to-peer payments more intuitive and enhance the seamless experience
NXP integrates the latest Industry 4.0 technologies into a comprehensive hardware and software platform to help develop smart, secure industrial iot applications. The flexible modular I. Mx RT industrial drive development platform supports multi-motor control and deterministic TSN communication, while laying a solid foundation for standards-compliant industrial network security. The hardware of the platform relies on I. MX RT1170 crossover MCU series and EdgeLock® SE05x security components.
