페이지 467 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PH4025L,115	NXP	MOSFET N-CH 25V 99A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 99A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 21.3nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 2601pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 46.4W (Tc) Rds On (Max) @ Id, Vgs: 4 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	패키지: SC-100, SOT-669	재고2,320
BF909,235	NXP	MOSFET N-CH 7V 40MA SOT143 Transistor Type: N-Channel Dual Gate Frequency: 800MHz Gain: - Voltage - Test: 5V Current Rating: 40mA Noise Figure: 2dB Current - Test: 15mA Power - Output: - Voltage - Rated: 7V Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	패키지: TO-253-4, TO-253AA	재고2,128
PZM3.6NB2A,115	NXP	DIODE ZENER 3.6V 220MW SMT3 Voltage - Zener (Nom) (Vz): 3.6V Tolerance: ±3% Power - Max: 220mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 5µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: - Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고39,000
MC34PF3000A1EP	NXP	IC POWER MANAGEMENT 48QFN Applications: Processor Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	패키지: 48-VFQFN Exposed Pad	재고8,652
TDA19997HL/C1,518	NXP	IC DVI/HDMI SWITCH 100LQFP Type: HDMI 1.4 Applications: HDMI, DVI, Receivers Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고4,864
MCZ33905BD5EKR2	NXP	IC SBC CAN HS 5.0V 54SOIC Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Mounting Type: Surface Mount	패키지: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	재고7,120
GTL2009PW,118	NXP	IC 3-BIT FREQ COMPARATOR 16TSSOP Applications: Compares FSB Frequency Inputs Interface: GTL, TTL Voltage - Supply: 3 V ~ 3.6 V Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP Mounting Type: Surface Mount	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고7,824
MC33972ATEK	NXP	IC SWITCH DETECT SPI 32-SOIC Applications: Switch Monitoring Interface: SPI Serial Voltage - Supply: 3.1 V ~ 5.25 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	패키지: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	재고28,032
PCA9621D,118	NXP	IC BUS OUTPUT PORT 2WIRE 16SOIC Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: No Features: - Output Type: Open Drain Current - Output Source/Sink: 65mA Clock Frequency: 1MHz Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고2,688
MC8640HX1250HE	NXP	IC MPU MPC86XX 1.25GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	패키지: 994-BCBGA, FCCBGA	재고6,656
MPC8572PXAULB	NXP	IC MPU MPC85XX 1.333GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	패키지: 1023-BFBGA, FCBGA	재고2,512
MPC8313VRAGDB	NXP	IC MPU MPC83XX 400MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	패키지: 516-BBGA Exposed Pad	재고3,232
KMPC8560PX667LC	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 784-BBGA, FCBGA	재고5,648
XPC850DSLVR50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	패키지: 256-BBGA	재고4,624
MCIMX6G3CVK05AB	NXP	IC MPU I.MX6UL 272BGA Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: - Supplier Device Package: -	패키지: -	재고7,904
MC9S08DZ32MLC	NXP	IC MCU 8BIT 32KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고4,944
MC68P11E1CFNE2R	NXP	IC MCU 8BIT ROMLESS 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	패키지: 52-LCC (J-Lead)	재고5,696
S912XHY256F0MLM	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 88 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고3,216
MC9S08AC48CFUE	NXP	IC MCU 8BIT 48KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고7,904
ADC1003S030TS/C1'1	NXP	IC ADC 10BIT 30MSPS SGL 28SSOP Number of Bits: 10 Sampling Rate (Per Second): 30M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: - Reference Type: Internal Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	패키지: 28-SSOP (0.209", 5.30mm Width)	재고6,464
MMA5112KW	NXP	ACCELEROMETER 120G PCM/SPI 16QFN Type: Digital Axis: Z Acceleration Range: ±120g Sensitivity (LSB/g): 4 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM, SPI Voltage - Supply: 4.2 V ~ 17 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	패키지: 16-QFN Exposed Pad	재고2,628
BGA3031J	NXP	IC MMIC 20HVQFN Frequency: 5MHz ~ 85MHz P1dB: - Gain: 34dB Noise Figure: 3.5dB RF Type: CATV Voltage - Supply: 5V Current - Supply: 325mA Test Frequency: - Package / Case: 20-VQFN Exposed Pad Supplier Device Package: 20-HVQFN (5x5)	패키지: 20-VQFN Exposed Pad	재고2,016
BGU8004Z	NXP	IC MMIC AMP LNA WLCSP6 Frequency: 1.559GHz ~ 1.61GHz P1dB: - Gain: 19dB Noise Figure: 0.6dB RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5 V ~ 3.1 V Current - Supply: 7.5mA Test Frequency: - Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (0.65x0.44)	패키지: 6-XFBGA, WLCSP	재고3,150
TFA9891UK/N1AZ	NXP	SMART AUDIO AMPLIFIER Type: Class D Output Type: 1-Channel (Mono) Max Output Power x Channels @ Load: 3.6W x 1 @ 8 Ohm Voltage - Supply: 2.7 V ~ 5.5 V Features: Depop, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 49-WLCSP (3.43x2.98) Package / Case: 49-UFBGA, WLCSP	패키지: 49-UFBGA, WLCSP	재고6,064
SAF7755HN/N208ZMP	NXP	CAR RADIO TUNER & AUDIO DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고3,664
MC9S08SH8MWJ	NXP	S08SH 8-BIT MCU S08 CORE 8KB F Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 17 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	패키지: 20-SOIC (0.295", 7.50mm Width)	재고4,736
S9S12G96J0CLHR	NXP	IC MCU 16BIT 96KB FLASH 64LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote
LS2084ASE7V17B	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16) SATA: SATA 6Gbps (2) USB: USB 3.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 1292-BBGA, FCBGA Supplier Device Package: 1292-FCPBGA (37.5x37.5)	패키지: -	Request a Quote

PH4025L,115

NXP

MOSFET N-CH 25V 99A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 99A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 21.3nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 2601pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 46.4W (Tc)
Rds On (Max) @ Id, Vgs: 4 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

패키지: SC-100, SOT-669

재고2,320

BF909,235

NXP

MOSFET N-CH 7V 40MA SOT143

Transistor Type: N-Channel Dual Gate
Frequency: 800MHz
Gain: -
Voltage - Test: 5V
Current Rating: 40mA
Noise Figure: 2dB
Current - Test: 15mA
Power - Output: -
Voltage - Rated: 7V
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

패키지: TO-253-4, TO-253AA

재고2,128

PZM3.6NB2A,115

NXP

DIODE ZENER 3.6V 220MW SMT3

Voltage - Zener (Nom) (Vz): 3.6V
Tolerance: ±3%
Power - Max: 220mW
Impedance (Max) (Zzt): 90 Ohms
Current - Reverse Leakage @ Vr: 5µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고39,000

MC34PF3000A1EP

NXP

IC POWER MANAGEMENT 48QFN

Applications: Processor
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

패키지: 48-VFQFN Exposed Pad

재고8,652

TDA19997HL/C1,518

NXP

IC DVI/HDMI SWITCH 100LQFP

Type: HDMI 1.4
Applications: HDMI, DVI, Receivers
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고4,864

MCZ33905BD5EKR2

NXP

IC SBC CAN HS 5.0V 54SOIC

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP
Mounting Type: Surface Mount

패키지: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

재고7,120

GTL2009PW,118

NXP

IC 3-BIT FREQ COMPARATOR 16TSSOP

Applications: Compares FSB Frequency Inputs
Interface: GTL, TTL
Voltage - Supply: 3 V ~ 3.6 V
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP
Mounting Type: Surface Mount

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고7,824

MC33972ATEK

NXP

IC SWITCH DETECT SPI 32-SOIC

Applications: Switch Monitoring
Interface: SPI Serial
Voltage - Supply: 3.1 V ~ 5.25 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

패키지: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

재고28,032

PCA9621D,118

NXP

IC BUS OUTPUT PORT 2WIRE 16SOIC

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: No
Features: -
Output Type: Open Drain
Current - Output Source/Sink: 65mA
Clock Frequency: 1MHz
Voltage - Supply: 2.7 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고2,688

MC8640HX1250HE

NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

패키지: 994-BCBGA, FCCBGA

재고6,656

MPC8572PXAULB

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

패키지: 1023-BFBGA, FCBGA

재고2,512

MPC8313VRAGDB

NXP

IC MPU MPC83XX 400MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

패키지: 516-BBGA Exposed Pad

재고3,232

KMPC8560PX667LC

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 784-BBGA, FCBGA

재고5,648

XPC850DSLVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

패키지: 256-BBGA

재고4,624

MCIMX6G3CVK05AB

NXP

IC MPU I.MX6UL 272BGA

Core Processor: ARM? Cortex?-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 528MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: -
Supplier Device Package: -

패키지: -

재고7,904

MC9S08DZ32MLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고4,944

MC68P11E1CFNE2R

NXP

IC MCU 8BIT ROMLESS 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 2MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

패키지: 52-LCC (J-Lead)

재고5,696

S912XHY256F0MLM

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 40MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 88
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 8K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고3,216

MC9S08AC48CFUE

NXP

IC MCU 8BIT 48KB FLASH 64QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고7,904

ADC1003S030TS/C1'1

NXP

IC ADC 10BIT 30MSPS SGL 28SSOP

Number of Bits: 10
Sampling Rate (Per Second): 30M
Number of Inputs: 1
Input Type: Single Ended
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: -
Reference Type: Internal
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP
Mounting Type: -

패키지: 28-SSOP (0.209", 5.30mm Width)

재고6,464

MMA5112KW

NXP

ACCELEROMETER 120G PCM/SPI 16QFN

Type: Digital
Axis: Z
Acceleration Range: ±120g
Sensitivity (LSB/g): 4
Sensitivity (mV/g): -
Bandwidth: -
Output Type: PCM, SPI
Voltage - Supply: 4.2 V ~ 17 V
Features: Selectable Low Pass Filter
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

패키지: 16-QFN Exposed Pad

재고2,628

BGA3031J

NXP

IC MMIC 20HVQFN

Frequency: 5MHz ~ 85MHz
P1dB: -
Gain: 34dB
Noise Figure: 3.5dB
RF Type: CATV
Voltage - Supply: 5V
Current - Supply: 325mA
Test Frequency: -
Package / Case: 20-VQFN Exposed Pad
Supplier Device Package: 20-HVQFN (5x5)

패키지: 20-VQFN Exposed Pad

재고2,016

BGU8004Z

NXP

IC MMIC AMP LNA WLCSP6

Frequency: 1.559GHz ~ 1.61GHz
P1dB: -
Gain: 19dB
Noise Figure: 0.6dB
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5 V ~ 3.1 V
Current - Supply: 7.5mA
Test Frequency: -
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (0.65x0.44)

패키지: 6-XFBGA, WLCSP

재고3,150

TFA9891UK/N1AZ

NXP

SMART AUDIO AMPLIFIER

Type: Class D
Output Type: 1-Channel (Mono)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8 Ohm
Voltage - Supply: 2.7 V ~ 5.5 V
Features: Depop, Short-Circuit and Thermal Protection
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 49-WLCSP (3.43x2.98)
Package / Case: 49-UFBGA, WLCSP

패키지: 49-UFBGA, WLCSP

재고6,064

SAF7755HN/N208ZMP

NXP

CAR RADIO TUNER & AUDIO DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고3,664

MC9S08SH8MWJ

NXP

S08SH 8-BIT MCU S08 CORE 8KB F

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 17
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

패키지: 20-SOIC (0.295", 7.50mm Width)

재고4,736

S9S12G96J0CLHR

NXP

IC MCU 16BIT 96KB FLASH 64LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: -

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LS2084ASE7V17B

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 8 Core, 64-Bit
Speed: 2GHz
Co-Processors/DSP: -
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
SATA: SATA 6Gbps (2)
USB: USB 3.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 1292-BBGA, FCBGA
Supplier Device Package: 1292-FCPBGA (37.5x37.5)

패키지: -

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