페이지 468 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PZM20NB2,115	NXP	DIODE ZENER 20V 300MW SMT3 Voltage - Zener (Nom) (Vz): 20V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 20 Ohms Current - Reverse Leakage @ Vr: 70nA @ 15V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고5,328
PZM12NB1,115	NXP	DIODE ZENER 12V 300MW SMT3 Voltage - Zener (Nom) (Vz): 12V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 9V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고6,208
UBA2025T/N1,518	NXP	IC DRIVER HALF BRIDGE 16-SOIC Type: CFL/TL Driver Frequency: 42.21kHz ~ 44.59kHz Voltage - Supply: 10.15 V ~ 11.95 V Current - Supply: 1.6mA Current - Output Source/Sink: 1.5A Dimming: No Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.295", 7.50mm Width)	재고6,752
74LVT16500ADL,518	NXP	IC UNIV BUS TXRX 18BIT 56SSOP Logic Type: Universal Bus Transceiver Number of Circuits: 18-Bit Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 56-SSOP	패키지: 56-BSSOP (0.295", 7.50mm Width)	재고7,936
PCA9306DP,118	NXP	IC LEVEL TRANSLATOR 8TSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	재고14,400
74HC253N,652	NXP	IC DUAL 4-IN MUX 3-ST 16DIP Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고2,144
74ALVT162821DGG:11	NXP	IC D-TYPE POS TRG DUAL 56TSSOP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 2 Number of Bits per Element: 10 Clock Frequency: 150MHz Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 8mA, 12mA; 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Current - Quiescent (Iq): - Input Capacitance: 3pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width)	패키지: 56-TFSOP (0.240", 6.10mm Width)	재고2,336
BGD814,112	NXP	IC AMP GAIN PWR 860MHZ SOT115J Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 395mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: - Package / Case: SOT-115J Supplier Device Package: SOT115J	패키지: SOT-115J	재고4,992
TDF8548AJ/N1ZU	NXP	IC AUDIO DEVICE DBS27P Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 28W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Short-Circuit and Thermal Protection Mounting Type: Through Hole Operating Temperature: - Supplier Device Package: DBS27P Package / Case: 27-SIP, Formed Leads	패키지: 27-SIP, Formed Leads	재고3,568
PCA9561PW,112	NXP	IC I2C EEPROM DIP SWITCH 20TSSOP Applications: Network, Telecom Interface: I2C, SMBus Voltage - Supply: 3 V ~ 3.6 V Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP Mounting Type: Surface Mount	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고6,928
PTN3342DH,112	NXP	IC HS DIFF LINE RECEIVER 16TSSOP Type: Receiver Protocol: LVDS Number of Drivers/Receivers: 0/4 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고2,720
MPC8548PXAUJD	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,488
P1010NSN5DFA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	패키지: 425-FBGA	재고6,368
MPC860DPVR50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고6,512
MPC860DTZQ50D4	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고7,408
MPC8536AVJATHA	NXP	IC MPU SOC 32BIT 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고4,208
MPC8272ZQMIBA	NXP	IC MPU MPC82XX 266MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	패키지: 516-BBGA	재고11,508
SPC5748GSK1MMN6	NXP	IC MCU 32BIT 6MB FLASH 324MAPBGA Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-LFBGA Supplier Device Package: 324-MAPBGA (19x19)	패키지: 324-LFBGA	재고4,992
MCHC11F1CFNE3R	NXP	IC MCU 8BIT ROMLESS 68PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	패키지: 68-LCC (J-Lead)	재고60,000
MKL03Z8VFK4	NXP	IC MCU 32BIT 8KB FLASH 24QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 7x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 24-UFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	패키지: 24-UFQFN Exposed Pad	재고7,008
MC9RS08KA2CSCR	NXP	IC MCU 8BIT 2KB FLASH 8SOIC Core Processor: RS08 Core Size: 8-Bit Speed: 10MHz Connectivity: - Peripherals: LVD, POR, WDT Number of I/O: 4 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 63 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	패키지: 8-SOIC (0.154", 3.90mm Width)	재고67,842
MMA5212NPKWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고3,420
MMPF0100FAAZES	NXP	POWER MANAGEMENT IC I.MX6 NO-P Applications: - Voltage - Input: - Number of Outputs: - Voltage - Output: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고7,808
T1024NSE7MQPA	NXP	QORIQ 2XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고5,168
S9S08EL16F1MTLR	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	패키지: 28-TSSOP (0.173", 4.40mm Width)	재고4,592
MKE16Z64VLF4	NXP	IC MCU 5V CM0+ TOUCH CAN 48LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고11,268
S32G254AABK0CUCT	NXP	S32G254A ARM CORTEX-M7 AND -A53, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (4) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	패키지: -	Request a Quote
SE050F2HQ1-Z018HZ	NXP	IC PLUG/TRUST SEC ELEM 20HX2QFN Type: Plug and Trust Secure Element Applications: - Mounting Type: Surface Mount Package / Case: 20-XFQFN Exposed Pad Supplier Device Package: 20-HX2QFN (3x3)	패키지: -	Request a Quote

PZM20NB2,115

NXP

DIODE ZENER 20V 300MW SMT3

Voltage - Zener (Nom) (Vz): 20V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 20 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 15V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고5,328

PZM12NB1,115

NXP

DIODE ZENER 12V 300MW SMT3

Voltage - Zener (Nom) (Vz): 12V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 9V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고6,208

UBA2025T/N1,518

NXP

IC DRIVER HALF BRIDGE 16-SOIC

Type: CFL/TL Driver
Frequency: 42.21kHz ~ 44.59kHz
Voltage - Supply: 10.15 V ~ 11.95 V
Current - Supply: 1.6mA
Current - Output Source/Sink: 1.5A
Dimming: No
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.295", 7.50mm Width)

재고6,752

74LVT16500ADL,518

NXP

IC UNIV BUS TXRX 18BIT 56SSOP

Logic Type: Universal Bus Transceiver
Number of Circuits: 18-Bit
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 56-SSOP

패키지: 56-BSSOP (0.295", 7.50mm Width)

재고7,936

PCA9306DP,118

NXP

IC LEVEL TRANSLATOR 8TSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 2
Voltage - VCCA: 1V ~ 3.6V
Voltage - VCCB: 1.8V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

재고14,400

74HC253N,652

NXP

IC DUAL 4-IN MUX 3-ST 16DIP

Type: Multiplexer
Circuit: 2 x 4:1
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고2,144

74ALVT162821DGG:11

NXP

IC D-TYPE POS TRG DUAL 56TSSOP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 2
Number of Bits per Element: 10
Clock Frequency: 150MHz
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 12mA; 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Current - Quiescent (Iq): -
Input Capacitance: 3pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)

패키지: 56-TFSOP (0.240", 6.10mm Width)

재고2,336

BGD814,112

NXP

IC AMP GAIN PWR 860MHZ SOT115J

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 395mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: -
Package / Case: SOT-115J
Supplier Device Package: SOT115J

패키지: SOT-115J

재고4,992

TDF8548AJ/N1ZU

NXP

IC AUDIO DEVICE DBS27P

Type: Class AB
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 28W x 4 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Short-Circuit and Thermal Protection
Mounting Type: Through Hole
Operating Temperature: -
Supplier Device Package: DBS27P
Package / Case: 27-SIP, Formed Leads

패키지: 27-SIP, Formed Leads

재고3,568

PCA9561PW,112

NXP

IC I2C EEPROM DIP SWITCH 20TSSOP

Applications: Network, Telecom
Interface: I2C, SMBus
Voltage - Supply: 3 V ~ 3.6 V
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP
Mounting Type: Surface Mount

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고6,928

PTN3342DH,112

NXP

IC HS DIFF LINE RECEIVER 16TSSOP

Type: Receiver
Protocol: LVDS
Number of Drivers/Receivers: 0/4
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고2,720

MPC8548PXAUJD

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,488

P1010NSN5DFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

패키지: 425-FBGA

재고6,368

MPC860DPVR50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고6,512

MPC860DTZQ50D4

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고7,408

MPC8536AVJATHA

NXP

IC MPU SOC 32BIT 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고4,208

MPC8272ZQMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

패키지: 516-BBGA

재고11,508

SPC5748GSK1MMN6

NXP

IC MCU 32BIT 6MB FLASH 324MAPBGA

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 246
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-LFBGA
Supplier Device Package: 324-MAPBGA (19x19)

패키지: 324-LFBGA

재고4,992

MCHC11F1CFNE3R

NXP

IC MCU 8BIT ROMLESS 68PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 30
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (25x25)

패키지: 68-LCC (J-Lead)

재고60,000

MKL03Z8VFK4

NXP

IC MCU 32BIT 8KB FLASH 24QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 7x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 24-UFQFN Exposed Pad
Supplier Device Package: 24-QFN (4x4)

패키지: 24-UFQFN Exposed Pad

재고7,008

MC9RS08KA2CSCR

NXP

IC MCU 8BIT 2KB FLASH 8SOIC

Core Processor: RS08
Core Size: 8-Bit
Speed: 10MHz
Connectivity: -
Peripherals: LVD, POR, WDT
Number of I/O: 4
Program Memory Size: 2KB (2K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 63 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

패키지: 8-SOIC (0.154", 3.90mm Width)

재고67,842

MMA5212NPKWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고3,420

MMPF0100FAAZES

NXP

POWER MANAGEMENT IC I.MX6 NO-P

Applications: -
Voltage - Input: -
Number of Outputs: -
Voltage - Output: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고7,808

T1024NSE7MQPA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,168

S9S08EL16F1MTLR

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

패키지: 28-TSSOP (0.173", 4.40mm Width)

재고4,592

MKE16Z64VLF4

NXP

IC MCU 5V CM0+ TOUCH CAN 48LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 12x12b; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고11,268

S32G254AABK0CUCT

NXP

S32G254A ARM CORTEX-M7 AND -A53,

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (4)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

패키지: -

Request a Quote

SE050F2HQ1-Z018HZ

NXP

IC PLUG/TRUST SEC ELEM 20HX2QFN

Type: Plug and Trust Secure Element
Applications: -
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Supplier Device Package: 20-HX2QFN (3x3)

패키지: -

Request a Quote