페이지 453 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  453/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2A4K87BTDF
TE Connectivity Passive Product

RES SMD 4.87K OHM 0.1% 1/8W 0805

  • Resistance: 4.87 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,174
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K75BTDF
TE Connectivity Passive Product

RES SMD 4.75K OHM 0.1% 1/8W 0805

  • Resistance: 4.75 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,802
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K64BTDF
TE Connectivity Passive Product

RES SMD 4.64K OHM 0.1% 1/8W 0805

  • Resistance: 4.64 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,912
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K53BTDF
TE Connectivity Passive Product

RES SMD 4.53K OHM 0.1% 1/8W 0805

  • Resistance: 4.53 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,356
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K42BTDF
TE Connectivity Passive Product

RES SMD 4.42K OHM 0.1% 1/8W 0805

  • Resistance: 4.42 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,100
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K32BTDF
TE Connectivity Passive Product

RES SMD 4.32K OHM 0.1% 1/8W 0805

  • Resistance: 4.32 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,844
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K22BTDF
TE Connectivity Passive Product

RES SMD 4.22K OHM 0.1% 1/8W 0805

  • Resistance: 4.22 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,132
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K12BTDF
TE Connectivity Passive Product

RES SMD 4.12K OHM 0.1% 1/8W 0805

  • Resistance: 4.12 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,642
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A4K02BTDF
TE Connectivity Passive Product

RES SMD 4.02K OHM 0.1% 1/8W 0805

  • Resistance: 4.02 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,884
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K92BTDF
TE Connectivity Passive Product

RES SMD 3.92K OHM 0.1% 1/8W 0805

  • Resistance: 3.92 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,010
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K83BTDF
TE Connectivity Passive Product

RES SMD 3.83K OHM 0.1% 1/8W 0805

  • Resistance: 3.83 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,100
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K74BTDF
TE Connectivity Passive Product

RES SMD 3.74K OHM 0.1% 1/8W 0805

  • Resistance: 3.74 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,130
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K65BTDF
TE Connectivity Passive Product

RES SMD 3.65K OHM 0.1% 1/8W 0805

  • Resistance: 3.65 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,320
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K57BTDF
TE Connectivity Passive Product

RES SMD 3.57K OHM 0.1% 1/8W 0805

  • Resistance: 3.57 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,408
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K48BTDF
TE Connectivity Passive Product

RES SMD 3.48K OHM 0.1% 1/8W 0805

  • Resistance: 3.48 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,124
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K4BTDF
TE Connectivity Passive Product

RES SMD 3.4K OHM 0.1% 1/8W 0805

  • Resistance: 3.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,664
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K32BTDF
TE Connectivity Passive Product

RES SMD 3.32K OHM 0.1% 1/8W 0805

  • Resistance: 3.32 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,880
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K24BTDF
TE Connectivity Passive Product

RES SMD 3.24K OHM 0.1% 1/8W 0805

  • Resistance: 3.24 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,690
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K16BTDF
TE Connectivity Passive Product

RES SMD 3.16K OHM 0.1% 1/8W 0805

  • Resistance: 3.16 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,218
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K09BTDF
TE Connectivity Passive Product

RES SMD 3.09K OHM 0.1% 1/8W 0805

  • Resistance: 3.09 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,302
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A3K01BTDF
TE Connectivity Passive Product

RES SMD 3.01K OHM 0.1% 1/8W 0805

  • Resistance: 3.01 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,652
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A2K94BTDF
TE Connectivity Passive Product

RES SMD 2.94K OHM 0.1% 1/8W 0805

  • Resistance: 2.94 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,654
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A2K87BTDF
TE Connectivity Passive Product

RES SMD 2.87K OHM 0.1% 1/8W 0805

  • Resistance: 2.87 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,334
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A2K8BTDF
TE Connectivity Passive Product

RES SMD 2.8K OHM 0.1% 1/8W 0805

  • Resistance: 2.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,862
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A2K74BTDF
TE Connectivity Passive Product

RES SMD 2.74K OHM 0.1% 1/8W 0805

  • Resistance: 2.74 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,606
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A2K67BTDF
TE Connectivity Passive Product

RES SMD 2.67K OHM 0.1% 1/8W 0805

  • Resistance: 2.67 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,608
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A2K61BTDF
TE Connectivity Passive Product

RES SMD 2.61K OHM 0.1% 1/8W 0805

  • Resistance: 2.61 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,588
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A2K55BTDF
TE Connectivity Passive Product

RES SMD 2.55K OHM 0.1% 1/8W 0805

  • Resistance: 2.55 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,490
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-