페이지 455 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  455/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2A18K7BTDF
TE Connectivity Passive Product

RES SMD 18.7K OHM 0.1% 1/8W 0805

  • Resistance: 18.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,128
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A18K2BTDF
TE Connectivity Passive Product

RES SMD 18.2K OHM 0.1% 1/8W 0805

  • Resistance: 18.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,330
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A17K8BTDF
TE Connectivity Passive Product

RES SMD 17.8K OHM 0.1% 1/8W 0805

  • Resistance: 17.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,220
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A17K4BTDF
TE Connectivity Passive Product

RES SMD 17.4K OHM 0.1% 1/8W 0805

  • Resistance: 17.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,304
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A16K9BTDF
TE Connectivity Passive Product

RES SMD 16.9K OHM 0.1% 1/8W 0805

  • Resistance: 16.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,706
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A16K5BTDF
TE Connectivity Passive Product

RES SMD 16.5K OHM 0.1% 1/8W 0805

  • Resistance: 16.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,364
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A16K2BTDF
TE Connectivity Passive Product

RES SMD 16.2K OHM 0.1% 1/8W 0805

  • Resistance: 16.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,694
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A15K8BTDF
TE Connectivity Passive Product

RES SMD 15.8K OHM 0.1% 1/8W 0805

  • Resistance: 15.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,628
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A15K4BTDF
TE Connectivity Passive Product

RES SMD 15.4K OHM 0.1% 1/8W 0805

  • Resistance: 15.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,210
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A15KBTDF
TE Connectivity Passive Product

RES SMD 15K OHM 0.1% 1/8W 0805

  • Resistance: 15 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,380
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A14K7BTDF
TE Connectivity Passive Product

RES SMD 14.7K OHM 0.1% 1/8W 0805

  • Resistance: 14.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,848
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A14K3BTDF
TE Connectivity Passive Product

RES SMD 14.3K OHM 0.1% 1/8W 0805

  • Resistance: 14.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,096
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A14KBTDF
TE Connectivity Passive Product

RES SMD 14K OHM 0.1% 1/8W 0805

  • Resistance: 14 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,698
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A13K7BTDF
TE Connectivity Passive Product

RES SMD 13.7K OHM 0.1% 1/8W 0805

  • Resistance: 13.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,856
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A13K3BTDF
TE Connectivity Passive Product

RES SMD 13.3K OHM 0.1% 1/8W 0805

  • Resistance: 13.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,680
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A13KBTDF
TE Connectivity Passive Product

RES SMD 13K OHM 0.1% 1/8W 0805

  • Resistance: 13 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,804
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A12K7BTDF
TE Connectivity Passive Product

RES SMD 12.7K OHM 0.1% 1/8W 0805

  • Resistance: 12.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,848
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A12K4BTDF
TE Connectivity Passive Product

RES SMD 12.4K OHM 0.1% 1/8W 0805

  • Resistance: 12.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,798
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A12K1BTDF
TE Connectivity Passive Product

RES SMD 12.1K OHM 0.1% 1/8W 0805

  • Resistance: 12.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,292
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A11K8BTDF
TE Connectivity Passive Product

RES SMD 11.8K OHM 0.1% 1/8W 0805

  • Resistance: 11.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,400
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A11K5BTDF
TE Connectivity Passive Product

RES SMD 11.5K OHM 0.1% 1/8W 0805

  • Resistance: 11.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,460
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A11K3BTDF
TE Connectivity Passive Product

RES SMD 11.3K OHM 0.1% 1/8W 0805

  • Resistance: 11.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,424
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A11KBTDF
TE Connectivity Passive Product

RES SMD 11K OHM 0.1% 1/8W 0805

  • Resistance: 11 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,568
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A10K7BTDF
TE Connectivity Passive Product

RES SMD 10.7K OHM 0.1% 1/8W 0805

  • Resistance: 10.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,736
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A10K5BTDF
TE Connectivity Passive Product

RES SMD 10.5K OHM 0.1% 1/8W 0805

  • Resistance: 10.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,154
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A10K2BTDF
TE Connectivity Passive Product

RES SMD 10.2K OHM 0.1% 1/8W 0805

  • Resistance: 10.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,172
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A10KBTDF
TE Connectivity Passive Product

RES SMD 10K OHM 0.1% 1/8W 0805

  • Resistance: 10 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,356
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A9K76BTDF
TE Connectivity Passive Product

RES SMD 9.76K OHM 0.1% 1/8W 0805

  • Resistance: 9.76 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,712
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-