페이지 456 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  456/546
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부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2A36K5BTDF
TE Connectivity Passive Product

RES SMD 36.5K OHM 0.1% 1/8W 0805

  • Resistance: 36.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,940
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A35K7BTDF
TE Connectivity Passive Product

RES SMD 35.7K OHM 0.1% 1/8W 0805

  • Resistance: 35.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,654
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A34K8BTDF
TE Connectivity Passive Product

RES SMD 34.8K OHM 0.1% 1/8W 0805

  • Resistance: 34.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,884
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A34KBTDF
TE Connectivity Passive Product

RES SMD 34K OHM 0.1% 1/8W 0805

  • Resistance: 34 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,572
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A33K2BTDF
TE Connectivity Passive Product

RES SMD 33.2K OHM 0.1% 1/8W 0805

  • Resistance: 33.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,344
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A32K4BTDF
TE Connectivity Passive Product

RES SMD 32.4K OHM 0.1% 1/8W 0805

  • Resistance: 32.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,092
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A31K6BTDF
TE Connectivity Passive Product

RES SMD 31.6K OHM 0.1% 1/8W 0805

  • Resistance: 31.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,814
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A30K9BTDF
TE Connectivity Passive Product

RES SMD 30.9K OHM 0.1% 1/8W 0805

  • Resistance: 30.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,784
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A30K1BTDF
TE Connectivity Passive Product

RES SMD 30.1K OHM 0.1% 1/8W 0805

  • Resistance: 30.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,474
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A29K4BTDF
TE Connectivity Passive Product

RES SMD 29.4K OHM 0.1% 1/8W 0805

  • Resistance: 29.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,716
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A28K7BTDF
TE Connectivity Passive Product

RES SMD 28.7K OHM 0.1% 1/8W 0805

  • Resistance: 28.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,848
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A28KBTDF
TE Connectivity Passive Product

RES SMD 28K OHM 0.1% 1/8W 0805

  • Resistance: 28 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,282
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A27K4BTDF
TE Connectivity Passive Product

RES SMD 27.4K OHM 0.1% 1/8W 0805

  • Resistance: 27.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,592
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A26K7BTDF
TE Connectivity Passive Product

RES SMD 26.7K OHM 0.1% 1/8W 0805

  • Resistance: 26.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,596
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A26K1BTDF
TE Connectivity Passive Product

RES SMD 26.1K OHM 0.1% 1/8W 0805

  • Resistance: 26.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,282
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A25K5BTDF
TE Connectivity Passive Product

RES SMD 25.5K OHM 0.1% 1/8W 0805

  • Resistance: 25.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,586
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A24K9BTDF
TE Connectivity Passive Product

RES SMD 24.9K OHM 0.1% 1/8W 0805

  • Resistance: 24.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,830
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A24K3BTDF
TE Connectivity Passive Product

RES SMD 24.3K OHM 0.1% 1/8W 0805

  • Resistance: 24.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,590
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A23K7BTDF
TE Connectivity Passive Product

RES SMD 23.7K OHM 0.1% 1/8W 0805

  • Resistance: 23.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,876
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A23K2BTDF
TE Connectivity Passive Product

RES SMD 23.2K OHM 0.1% 1/8W 0805

  • Resistance: 23.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,420
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A22K6BTDF
TE Connectivity Passive Product

RES SMD 22.6K OHM 0.1% 1/8W 0805

  • Resistance: 22.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,532
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A22K1BTDF
TE Connectivity Passive Product

RES SMD 22.1K OHM 0.1% 1/8W 0805

  • Resistance: 22.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,932
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A21K5BTDF
TE Connectivity Passive Product

RES SMD 21.5K OHM 0.1% 1/8W 0805

  • Resistance: 21.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,610
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A21KBTDF
TE Connectivity Passive Product

RES SMD 21K OHM 0.1% 1/8W 0805

  • Resistance: 21 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,840
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A20K5BTDF
TE Connectivity Passive Product

RES SMD 20.5K OHM 0.1% 1/8W 0805

  • Resistance: 20.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,910
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A20KBTDF
TE Connectivity Passive Product

RES SMD 20K OHM 0.1% 1/8W 0805

  • Resistance: 20 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,310
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A19K6BTDF
TE Connectivity Passive Product

RES SMD 19.6K OHM 0.1% 1/8W 0805

  • Resistance: 19.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,298
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A19K1BTDF
TE Connectivity Passive Product

RES SMD 19.1K OHM 0.1% 1/8W 0805

  • Resistance: 19.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,698
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-