페이지 457 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  457/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2A71K5BTDF
TE Connectivity Passive Product

RES SMD 71.5K OHM 0.1% 1/8W 0805

  • Resistance: 71.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,176
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A69K8BTDF
TE Connectivity Passive Product

RES SMD 69.8K OHM 0.1% 1/8W 0805

  • Resistance: 69.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,174
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A68K1BTDF
TE Connectivity Passive Product

RES SMD 68.1K OHM 0.1% 1/8W 0805

  • Resistance: 68.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,966
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A66K5BTDF
TE Connectivity Passive Product

RES SMD 66.5K OHM 0.1% 1/8W 0805

  • Resistance: 66.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,822
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A64K9BTDF
TE Connectivity Passive Product

RES SMD 64.9K OHM 0.1% 1/8W 0805

  • Resistance: 64.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,078
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A63K4BTDF
TE Connectivity Passive Product

RES SMD 63.4K OHM 0.1% 1/8W 0805

  • Resistance: 63.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,382
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A61K9BTDF
TE Connectivity Passive Product

RES SMD 61.9K OHM 0.1% 1/8W 0805

  • Resistance: 61.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,286
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A60K4BTDF
TE Connectivity Passive Product

RES SMD 60.4K OHM 0.1% 1/8W 0805

  • Resistance: 60.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,678
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A59KBTDF
TE Connectivity Passive Product

RES SMD 59K OHM 0.1% 1/8W 0805

  • Resistance: 59 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,848
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A57K6BTDF
TE Connectivity Passive Product

RES SMD 57.6K OHM 0.1% 1/8W 0805

  • Resistance: 57.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,136
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A56K2BTDF
TE Connectivity Passive Product

RES SMD 56.2K OHM 0.1% 1/8W 0805

  • Resistance: 56.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,716
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A54K9BTDF
TE Connectivity Passive Product

RES SMD 54.9K OHM 0.1% 1/8W 0805

  • Resistance: 54.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,318
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A53K6BTDF
TE Connectivity Passive Product

RES SMD 53.6K OHM 0.1% 1/8W 0805

  • Resistance: 53.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,032
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A52K3BTDF
TE Connectivity Passive Product

RES SMD 52.3K OHM 0.1% 1/8W 0805

  • Resistance: 52.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,626
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A51K1BTDF
TE Connectivity Passive Product

RES SMD 51.1K OHM 0.1% 1/8W 0805

  • Resistance: 51.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,960
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A49K9BTDF
TE Connectivity Passive Product

RES SMD 49.9K OHM 0.1% 1/8W 0805

  • Resistance: 49.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,640
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A48K7BTDF
TE Connectivity Passive Product

RES SMD 48.7K OHM 0.1% 1/8W 0805

  • Resistance: 48.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,426
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A47K5BTDF
TE Connectivity Passive Product

RES SMD 47.5K OHM 0.1% 1/8W 0805

  • Resistance: 47.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,230
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A46K4BTDF
TE Connectivity Passive Product

RES SMD 46.4K OHM 0.1% 1/8W 0805

  • Resistance: 46.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,194
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A45K3BTDF
TE Connectivity Passive Product

RES SMD 45.3K OHM 0.1% 1/8W 0805

  • Resistance: 45.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,768
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A44K2BTDF
TE Connectivity Passive Product

RES SMD 44.2K OHM 0.1% 1/8W 0805

  • Resistance: 44.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,086
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A43K2BTDF
TE Connectivity Passive Product

RES SMD 43.2K OHM 0.1% 1/8W 0805

  • Resistance: 43.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,590
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A42K2BTDF
TE Connectivity Passive Product

RES SMD 42.2K OHM 0.1% 1/8W 0805

  • Resistance: 42.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,246
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A41K2BTDF
TE Connectivity Passive Product

RES SMD 41.2K OHM 0.1% 1/8W 0805

  • Resistance: 41.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,794
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A40K2BTDF
TE Connectivity Passive Product

RES SMD 40.2K OHM 0.1% 1/8W 0805

  • Resistance: 40.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,826
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A39K2BTDF
TE Connectivity Passive Product

RES SMD 39.2K OHM 0.1% 1/8W 0805

  • Resistance: 39.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,480
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A38K3BTDF
TE Connectivity Passive Product

RES SMD 38.3K OHM 0.1% 1/8W 0805

  • Resistance: 38.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,016
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RP73D2A37K4BTDF
TE Connectivity Passive Product

RES SMD 37.4K OHM 0.1% 1/8W 0805

  • Resistance: 37.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,016
±0.1%
0.125W, 1/8W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-