페이지 539 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
고객 문의
SalesDept@heisener.com +86-755-83210559-836
로그인/등록
Language Translation

* Please refer to the English Version as our Official Version.

BOM
카트 0

TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  539/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
SP218RJT
TE Connectivity Passive Product

RES SMD 18 OHM 5% 2.5W 4823

  • Resistance: 18 Ohms
  • Tolerance: ±5%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±30ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고2,340
±5%
2.5W
Wirewound
Current Sense, Moisture Resistant
±30ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SL1R062ET
TE Connectivity Passive Product

RES SMD 0.062 OHM 3% 1W 2615

  • Resistance: 62 mOhms
  • Tolerance: ±3%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고3,798
±3%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R05JT
TE Connectivity Passive Product

RES SMD 0.05 OHM 5% 1W 2615

  • Resistance: 50 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고5,094
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R047JT
TE Connectivity Passive Product

RES SMD 0.047 OHM 5% 1W 2615

  • Resistance: 47 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고5,922
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R022JT
TE Connectivity Passive Product

RES SMD 0.022 OHM 5% 1W 2615

  • Resistance: 22 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고5,994
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
CGSSL1R015J
TE Connectivity Passive Product

RES SMD 0.015 OHM 5% 1W 2615

  • Resistance: 15 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고4,788
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
CGSSL1R033J
TE Connectivity Passive Product

RES SMD 0.033 OHM 5% 1W 2615

  • Resistance: 33 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고5,346
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
CGSSL1R005J
TE Connectivity Passive Product

RES SMD 0.005 OHM 5% 1W 2615

  • Resistance: 5 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고5,850
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
CGSSL1R068J
TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 1W 2615

  • Resistance: 68 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고5,688
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
CGSSL1R051J
TE Connectivity Passive Product

RES SMD 0.051 OHM 5% 1W 2615

  • Resistance: 51 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고4,032
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R068JT
TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 1W 2615

  • Resistance: 68 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고4,266
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R051JT
TE Connectivity Passive Product

RES SMD 0.051 OHM 5% 1W 2615

  • Resistance: 51 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고6,534
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R01JT
TE Connectivity Passive Product

RES SMD 0.01 OHM 5% 1W 2615

  • Resistance: 10 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고4,374
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
RH73X2A33GKTN
TE Connectivity Passive Product

RES SMD 33G OHM 10% 1/8W 0805

  • Resistance: 33 GOhms
  • Tolerance: ±10%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±1000ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.047" W (2.00mm x 1.20mm)
  • Height - Seated (Max): 0.020" (0.50mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,392
±10%
0.125W, 1/8W
Thick Film
-
±1000ppm/°C
-55°C ~ 125°C
0805 (2012 Metric)
0805
0.079" L x 0.047" W (2.00mm x 1.20mm)
0.020" (0.50mm)
2
-
CGSSL2R068J
TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 2W 4823

  • Resistance: 68 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고5,004
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
CGSSL2R051J
TE Connectivity Passive Product

RES SMD 0.051 OHM 5% 2W 4823

  • Resistance: 51 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고6,534
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
CGSSL2R047J
TE Connectivity Passive Product

RES SMD 0.047 OHM 5% 2W 4823

  • Resistance: 47 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고5,724
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
CGSSL2R033J
TE Connectivity Passive Product

RES SMD 0.033 OHM 5% 2W 4823

  • Resistance: 33 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고5,940
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
CGSSL2R022J
TE Connectivity Passive Product

RES SMD 0.022 OHM 5% 2W 4823

  • Resistance: 22 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고3,582
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
CGSSL2R01J
TE Connectivity Passive Product

RES SMD 0.01 OHM 5% 2W 4823

  • Resistance: 10 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고5,058
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
CGSSL2R015J
TE Connectivity Passive Product

RES SMD 0.015 OHM 5% 2W 4823

  • Resistance: 15 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고4,266
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SL2R005JT
TE Connectivity Passive Product

RES SMD 0.005 OHM 5% 2W 4823

  • Resistance: 5 mOhms
  • Tolerance: ±5%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고6,210
±5%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
RN73C2A2K0LTDF
TE Connectivity Passive Product

RES SMD 2K OHM 0.01% 1/10W 0805

  • Resistance: 2 kOhms
  • Tolerance: ±0.01%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,004
±0.01%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RH73X2A50GNTN
TE Connectivity Passive Product

RES SMD 50G OHM 30% 1/8W 0805

  • Resistance: 50 GOhms
  • Tolerance: ±30%
  • Power (Watts): 0.125W, 1/8W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±1000ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.047" W (2.00mm x 1.20mm)
  • Height - Seated (Max): 0.020" (0.50mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,418
±30%
0.125W, 1/8W
Thick Film
-
±1000ppm/°C
-55°C ~ 125°C
0805 (2012 Metric)
0805
0.079" L x 0.047" W (2.00mm x 1.20mm)
0.020" (0.50mm)
2
-
RH73H1E22MJTN
TE Connectivity Passive Product

RES SMD 22M OHM 5% 1/20W 0402

  • Resistance: 22 MOhms
  • Tolerance: ±5%
  • Power (Watts): 0.05W, 1/20W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0402 (1005 Metric)
  • Supplier Device Package: 0402
  • Size / Dimension: 0.041" L x 0.020" W (1.04mm x 0.50mm)
  • Height - Seated (Max): 0.014" (0.35mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0402 (1005 Metric)
재고4,194
±5%
0.05W, 1/20W
Thick Film
-
±100ppm/°C
-55°C ~ 125°C
0402 (1005 Metric)
0402
0.041" L x 0.020" W (1.04mm x 0.50mm)
0.014" (0.35mm)
2
-
RN73C2A1K0LTDF
TE Connectivity Passive Product

RES SMD 1K OHM 0.01% 1/10W 0805

  • Resistance: 1 kOhms
  • Tolerance: ±0.01%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,526
±0.01%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A10KLTDF
TE Connectivity Passive Product

RES SMD 10K OHM 0.01% 1/10W 0805

  • Resistance: 10 kOhms
  • Tolerance: ±0.01%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,924
±0.01%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A102KLTDF
TE Connectivity Passive Product

RES SMD 102KOHM 0.01% 1/10W 0805

  • Resistance: 102 kOhms
  • Tolerance: ±0.01%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,406
±0.01%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-