페이지 541 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  541/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
1-1622821-8
TE Connectivity Passive Product

RES SMD 0.075 OHM 5% 1/4W 1220

  • Resistance: 75 mOhms
  • Tolerance: ±5%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thick Film
  • Features: Current Sense
  • Temperature Coefficient: ±350ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 1220
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.020" (0.50mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,722
±5%
0.25W, 1/4W
Thick Film
Current Sense
±350ppm/°C
-55°C ~ 125°C
0805 (2012 Metric)
1220
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.020" (0.50mm)
2
-
1-1622821-0
TE Connectivity Passive Product

RES SMD 5.6 OHM 5% 1/4W 1220

  • Resistance: 5.6 Ohms
  • Tolerance: ±5%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thick Film
  • Features: Current Sense
  • Temperature Coefficient: ±350ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 1220
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.020" (0.50mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,322
±5%
0.25W, 1/4W
Thick Film
Current Sense
±350ppm/°C
-55°C ~ 125°C
0805 (2012 Metric)
1220
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.020" (0.50mm)
2
-
3-1622821-3
TE Connectivity Passive Product

RES SMD 0.47 OHM 1% 1/4W 1220

  • Resistance: 470 mOhms
  • Tolerance: ±1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thick Film
  • Features: Current Sense
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 1220
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.020" (0.50mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,122
±1%
0.25W, 1/4W
Thick Film
Current Sense
±200ppm/°C
-55°C ~ 125°C
0805 (2012 Metric)
1220
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.020" (0.50mm)
2
-
6-1622821-3
TE Connectivity Passive Product

RES SMD 0.033 OHM 5% 1/4W 1220

  • Resistance: 33 mOhms
  • Tolerance: ±5%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thick Film
  • Features: Current Sense
  • Temperature Coefficient: ±350ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 1220
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.020" (0.50mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,596
±5%
0.25W, 1/4W
Thick Film
Current Sense
±350ppm/°C
-55°C ~ 125°C
0805 (2012 Metric)
1220
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.020" (0.50mm)
2
-
SP12K21BT
TE Connectivity Passive Product

RES SMD 2.21K OHM 0.1% 1.5W 2615

  • Resistance: 2.21 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고7,704
±0.1%
1.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP37R0FL
TE Connectivity Passive Product

RES SMD 7 OHM 1% 3.5W 6028

  • Resistance: 7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 3.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고3,636
±1%
3.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
SP32R0FL
TE Connectivity Passive Product

RES SMD 2 OHM 1% 3.5W 6028

  • Resistance: 2 Ohms
  • Tolerance: ±1%
  • Power (Watts): 3.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고2,178
±1%
3.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
SP12K21B
TE Connectivity Passive Product

RES SMD 2.21K OHM 0.1% 1.5W 2615

  • Resistance: 2.21 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고2,808
±0.1%
1.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP1R12J
TE Connectivity Passive Product

RES SMD 0.12 OHM 5% 1.5W 2615

  • Resistance: 120 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±90ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고2,484
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±90ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP1R10J
TE Connectivity Passive Product

RES SMD 0.1 OHM 5% 1.5W 2615

  • Resistance: 100 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±90ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고2,700
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±90ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP110RF
TE Connectivity Passive Product

RES SMD 10 OHM 1% 1.5W 2615

  • Resistance: 10 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고4,842
±1%
1.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL3R01J
TE Connectivity Passive Product

RES SMD 0.01 OHM 5% 3W 6028

  • Resistance: 10 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고5,724
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
SP23K16F
TE Connectivity Passive Product

RES SMD 3.16K OHM 1% 2.5W 4823

  • Resistance: 3.16 kOhms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고6,678
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP213R3F
TE Connectivity Passive Product

RES SMD 13.3 OHM 1% 2.5W 4823

  • Resistance: 13.3 Ohms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±30ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고6,732
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±30ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP1150RFT
TE Connectivity Passive Product

RES SMD 150 OHM 1% 1.5W 2615

  • Resistance: 150 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고7,218
±1%
1.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP1120RFT
TE Connectivity Passive Product

RES SMD 120 OHM 1% 1.5W 2615

  • Resistance: 120 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고3,654
±1%
1.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP25K6FT
TE Connectivity Passive Product

RES SMD 5.6K OHM 1% 2.5W 4823

  • Resistance: 5.6 kOhms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고7,938
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
CGSSL3R068J
TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 3W 6028

  • Resistance: 68 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고3,420
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
CGSSL3R051J
TE Connectivity Passive Product

RES SMD 0.051 OHM 5% 3W 6028

  • Resistance: 51 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고8,784
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
CGSSL3R047J
TE Connectivity Passive Product

RES SMD 0.047 OHM 5% 3W 6028

  • Resistance: 47 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고7,038
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
CGSSL3R033J
TE Connectivity Passive Product

RES SMD 0.033 OHM 5% 3W 6028

  • Resistance: 33 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고7,128
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
CGSSL3R022J
TE Connectivity Passive Product

RES SMD 0.022 OHM 5% 3W 6028

  • Resistance: 22 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고7,020
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
CGSSL3R01J
TE Connectivity Passive Product

RES SMD 0.01 OHM 5% 3W 6028

  • Resistance: 10 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고5,634
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
CGSSL3R015J
TE Connectivity Passive Product

RES SMD 0.015 OHM 5% 3W 6028

  • Resistance: 15 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고3,978
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
CGSSL3R005J
TE Connectivity Passive Product

RES SMD 0.005 OHM 5% 3W 6028

  • Resistance: 5 mOhms
  • Tolerance: ±5%
  • Power (Watts): 3W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고6,822
±5%
3W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
SL1R02F
TE Connectivity Passive Product

RES SMD 0.02 OHM 1% 1W 2615

  • Resistance: 20 mOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고4,950
±1%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP110RFT
TE Connectivity Passive Product

RES SMD 10 OHM 1% 1.5W 2615

  • Resistance: 10 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고5,580
±1%
1.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
RH73X1E10GKTN
TE Connectivity Passive Product

RES SMD 10G OHM 10% 1/20W 0402

  • Resistance: 10 GOhms
  • Tolerance: ±10%
  • Power (Watts): 0.05W, 1/20W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±1000ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 0402 (1005 Metric)
  • Supplier Device Package: 0402
  • Size / Dimension: 0.041" L x 0.020" W (1.04mm x 0.50mm)
  • Height - Seated (Max): 0.020" (0.50mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0402 (1005 Metric)
재고5,436
±10%
0.05W, 1/20W
Thick Film
-
±1000ppm/°C
-55°C ~ 125°C
0402 (1005 Metric)
0402
0.041" L x 0.020" W (1.04mm x 0.50mm)
0.020" (0.50mm)
2
-