페이지 540 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  540/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
SP1150RFR
TE Connectivity Passive Product

RES SMD 150 OHM 1% 1.5W 2615

  • Resistance: 150 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고5,832
±1%
1.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP31R0JT
TE Connectivity Passive Product

RES SMD 1 OHM 5% 3.5W 6028

  • Resistance: 1 Ohms
  • Tolerance: ±5%
  • Power (Watts): 3.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 6028 (15270 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
  • Height - Seated (Max): 0.255" (6.48mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 6028 (15270 Metric), J-Lead
재고5,418
±5%
3.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
6028 (15270 Metric), J-Lead
SMD
0.600" L x 0.276" W (15.24mm x 7.00mm)
0.255" (6.48mm)
2
-
SP24K7FT
TE Connectivity Passive Product

RES SMD 4.7K OHM 1% 2.5W 4823

  • Resistance: 4.7 kOhms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고7,038
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP23K16FT
TE Connectivity Passive Product

RES SMD 3.16K OHM 1% 2.5W 4823

  • Resistance: 3.16 kOhms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고8,046
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP21K5FT
TE Connectivity Passive Product

RES SMD 1.5K OHM 1% 2.5W 4823

  • Resistance: 1.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고4,086
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP2R59FT
TE Connectivity Passive Product

RES SMD 0.59 OHM 1% 2.5W 4823

  • Resistance: 590 mOhms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±90ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고2,286
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±90ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP1R10JT
TE Connectivity Passive Product

RES SMD 0.1 OHM 5% 1.5W 2615

  • Resistance: 100 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±90ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고4,842
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±90ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP1/2100RJT
TE Connectivity Passive Product

RES SMD 100 OHM 5% 3/4W 2015

  • Resistance: 100 Ohms
  • Tolerance: ±5%
  • Power (Watts): 0.75W, 3/4W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±30ppm/°C
  • Operating Temperature: -
  • Package / Case: 2015 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.215" L x 0.125" W (5.46mm x 3.18mm)
  • Height - Seated (Max): 0.100" (2.54mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2015 J-Lead
재고3,240
±5%
0.75W, 3/4W
Wirewound
Current Sense, Moisture Resistant
±30ppm/°C
-
2015 J-Lead
SMD
0.215" L x 0.125" W (5.46mm x 3.18mm)
0.100" (2.54mm)
2
-
SP268RFT
TE Connectivity Passive Product

RES SMD 68 OHM 1% 2.5W 4823

  • Resistance: 68 Ohms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±30ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고4,212
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±30ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP21R0FT
TE Connectivity Passive Product

RES SMD 1 OHM 1% 2.5W 4823

  • Resistance: 1 Ohms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고7,146
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP213R3FT
TE Connectivity Passive Product

RES SMD 13.3 OHM 1% 2.5W 4823

  • Resistance: 13.3 Ohms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±30ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고3,942
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±30ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP1220RJT
TE Connectivity Passive Product

RES SMD 220 OHM 5% 1.5W 2615

  • Resistance: 220 Ohms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고3,582
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP1110RJT
TE Connectivity Passive Product

RES SMD 110 OHM 5% 1.5W 2615

  • Resistance: 110 Ohms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고4,734
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP2249RFT
TE Connectivity Passive Product

RES SMD 249 OHM 1% 2.5W 4823

  • Resistance: 249 Ohms
  • Tolerance: ±1%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고3,438
±1%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SL1R10JT
TE Connectivity Passive Product

RES SMD 0.1 OHM 5% 1W 2615

  • Resistance: 100 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고4,950
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R068J
TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 1W 2615

  • Resistance: 68 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고8,874
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R01J
TE Connectivity Passive Product

RES SMD 0.01 OHM 5% 1W 2615

  • Resistance: 10 mOhms
  • Tolerance: ±5%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고2,250
±5%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP195R3JT
TE Connectivity Passive Product

RES SMD 95.3 OHM 5% 1.5W 2615

  • Resistance: 95.3 Ohms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±30ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고8,298
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±30ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP11R5JT
TE Connectivity Passive Product

RES SMD 1.5 OHM 5% 1.5W 2615

  • Resistance: 1.5 Ohms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고8,532
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP11R0JT
TE Connectivity Passive Product

RES SMD 1 OHM 5% 1.5W 2615

  • Resistance: 1 Ohms
  • Tolerance: ±5%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고4,122
±5%
1.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP110RET
TE Connectivity Passive Product

RES SMD 10 OHM 3% 1.5W 2615

  • Resistance: 10 Ohms
  • Tolerance: ±3%
  • Power (Watts): 1.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 J-Lead
재고2,016
±3%
1.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
2615 J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SL1R022FT
TE Connectivity Passive Product

RES SMD 0.022 OHM 1% 1W 2615

  • Resistance: 22 mOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고7,974
±1%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP210KJT
TE Connectivity Passive Product

RES SMD 10K OHM 5% 2.5W 4823

  • Resistance: 10 kOhms
  • Tolerance: ±5%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고6,210
±5%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SL2R022FT
TE Connectivity Passive Product

RES SMD 0.022 OHM 1% 2W 4823

  • Resistance: 22 mOhms
  • Tolerance: ±1%
  • Power (Watts): 2W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 (12158 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 (12158 Metric), J-Lead
재고8,316
±1%
2W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
4823 (12158 Metric), J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP2220RJT
TE Connectivity Passive Product

RES SMD 220 OHM 5% 2.5W 4823

  • Resistance: 220 Ohms
  • Tolerance: ±5%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±20ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고3,544
±5%
2.5W
Wirewound
Current Sense, Moisture Resistant
±20ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SL1R03FT
TE Connectivity Passive Product

RES SMD 0.03 OHM 1% 1W 2615

  • Resistance: 30 mOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Metal Foil
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -
  • Package / Case: 2615 (6538 Metric), J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
  • Height - Seated (Max): 0.112" (2.84mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 2615 (6538 Metric), J-Lead
재고6,336
±1%
1W
Metal Foil
Current Sense, Moisture Resistant
±100ppm/°C
-
2615 (6538 Metric), J-Lead
SMD
0.255" L x 0.150" W (6.48mm x 3.81mm)
0.112" (2.84mm)
2
-
SP233RJT
TE Connectivity Passive Product

RES SMD 33 OHM 5% 2.5W 4823

  • Resistance: 33 Ohms
  • Tolerance: ±5%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±30ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고3,150
±5%
2.5W
Wirewound
Current Sense, Moisture Resistant
±30ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-
SP22R2JT
TE Connectivity Passive Product

RES SMD 2.2 OHM 5% 2.5W 4823

  • Resistance: 2.2 Ohms
  • Tolerance: ±5%
  • Power (Watts): 2.5W
  • Composition: Wirewound
  • Features: Current Sense, Moisture Resistant
  • Temperature Coefficient: ±50ppm/°C
  • Operating Temperature: -
  • Package / Case: 4823 J-Lead
  • Supplier Device Package: SMD
  • Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
  • Height - Seated (Max): 0.210" (5.33mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 4823 J-Lead
재고2,952
±5%
2.5W
Wirewound
Current Sense, Moisture Resistant
±50ppm/°C
-
4823 J-Lead
SMD
0.478" L x 0.230" W (12.14mm x 5.84mm)
0.210" (5.33mm)
2
-