Cadence Design Systems has launched the Cadence Allegro X Design Platform, the industry’s first engineering platform for system design that unifies schematic, analysis, layout, design collaboration and data management. Constructed upon proven Allegro and OrCAD core technology, the new platform revolutionises and streamlines the system design process for engineers providing exceptional collaboration overall engineering disciplines, integrating best-in-class Cadence signoff-level simulation and analysis products, and more excellent layout performance.
Molex Micro-FIT + Connector is A wire-to-board system that provides 3mm spacing, A higher current rating of 12.5a, and superior design options for flexible and efficient assembly.
RS Components has launched the RS PRO cabling and connecting product portfolio aimed at a wide variety of customers, a range that should be very attractive to electronic systems designers, as well as component buyers, maintenance engineers and technicians, and machine and equipment builders. Suitable for many industrial and network applications in multiple market segments.
TE Connectivity's NECTOR T Pluggable Lighting Connector system provides an easy-to-use, pluggable power distribution connector-cable system suitable for wet and humid environments (IP68). The system is easy to install and repair with standard tools. It provides flexibility and material costs by reducing waste during installation
The Flex power module provides the BMR482, its second generation direct conversion isolated DC-DC converter. The device achieves a maximum efficiency of 91.3% at 0.8V output at 53Vin, 2-3% higher than the IBC - and POL-based equivalent scheme. The size is only 30mm x 12.7mm x 16.8mm, and up to 5 'satellite' modules can be added if higher output current is required. The device is compatible with PMBus V1.3, AVSBus and Intel SVID interfaces, providing complete digital control. Make power system design simpler and faster
Cliff Electronics has introduced a universal USB-C cable for men and women that supports PD charging at 60W (20V / @3a) and USB 3.1 (Gen 1) at 5Gb/s data transfer speeds. The new cable can be used with a variety of Cliff USBC XLR and DualSLIMS female to male feed-through connectors, available in metal or plastic and many assembly options.
Xilinx has introduced the Versal AI Edge family of products with 4 times AI power performance and 10 times computational density compared to the previous generation of adaptive soCs. The ACAPs family provides intelligence for a wide range of applications. The latest member of the Versal ACAP family, It is considered the world's most scalable and adaptable combination of next generation distributed intelligent systems.
Mouser offers the new Laird Connectivity Mini NanoBlade Flex 6E Series internal antenna. Suitable for space-constrained iot applications.
From September 2021, customers creating iot projects will be able to take advantage of the new Pycom Evaluation Toolkit based on Murata, which offers full-stack iot.
As the mechanization and automation systems of moving machinery in agriculture, construction, municipal and related industries become increasingly complex, to address this problem, Novotechnik produces precision magnetic rotating position sensors in non-contact, non-contact and long-life designs. These sensors offer shaft drive designs with encapsulated, non-contact magnets and sensor electronics that are very rugged and ideal for mobile mechanical positioning of mechanical lifts and linkages, cams, cranks and steering
Applications including e-scooters, e-forklifts and other LEVs, as well as power tools and battery management systems, necessitate high current rating, ruggedness and extended lifetime. Infineon Technologies AG answers these demands by providing more choices to power system designers to satisfy diverse design requirements and deliver maximum performance in the smallest space.
Hammond Electronics' 1551 Miniature plastic case home includes 49 different sizes, in addition to size and configuration options, select colors, flange covers, key rings and USB C versions are also available. One key feature is the snap closure, which allows the PCB to be opened and closed repeatedly without tools and maximizes the internal space of the PCB by removing the screw fixation to secure the cover to the base. All dimensions are 20mm high, providing enough space for onboard RJ45, USB and other standard communication interfaces.
Mouser has partnered with Microchip Technology to publish a new e-book that highlights products and technologies that will drive the next generation of automotive solutions. Modern cars are highly connected, with sensors monitoring key indicators and autonomous features supporting automatic parking and lane departure assistance. Solutions include microcontrollers, sensors, power supplies, antennas, and embedded
Mouser now offers the Kria KV260 Visual AI starter kit from Xilinx. The suite is designed to support accelerated visual applications. The suite is an out-of-the-box platform that also allows developers to add customization and differentiation at any level of abstraction, from application software to AI models to FPGA designs, through the preferred design environment
The Pico-TGU4 is a compact Pico-ITX single board powered by Intel's 11th generation tiger Lake U processor, which offers a 23% performance improvement over previous generations. The 2.5-inch device can be deployed in almost any tight space. Leveraging 11th generation Intel Core I3 / I5 / I7 and Celeron processors, it also leverages new Tiger Lake technology to offer an expanded selection of I/O capabilities
Fujikura has launched a new splicing and glass protecting system, the LZM-125 Series, which works in conjunction with onboard firmware to produce fully automatic glass shaping processes.The system employs a CO2 laser heat source to perform splicing, tapering, lensing and other high precision glass shaping operations with glass diameters of 2mm or less.
ON Semiconductor announces a pair of 1200 V full SiC MOSFET 2-PACK modules, further improving their range of products fit for the challenging EV market.The new module is based on planar technology and is suitable for driving voltages in the 18-20V range. Driving with negative gate voltage is very simple. The new SiC MOSFET module has been running with driver solutions such as the NCD5700x device
THine Electronics has launched a new standalone ISP, THP7312-P, which supports all the features of existing THP7312, but provides higher video streaming resolution at higher frame rates. The new ISP offers two package options, a BGA (8mm x 8mm) and a smaller WLCSP (3.9mm x 4mm). Support YUV format video streaming resolution up to 4K 30fps.
