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최신 기술

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Technology Cover

2023-04-29, STMicroelectronics introduces monolithic antenna matching ics for BlueNRG-LPS system chips

Two new products have been added to the STMicroelectronics monolithic antenna matching IC series, namely MLPF-NRG-01D3 for BlueNRG-LPS System chip (SoC) and MLPF-WB-02D3 for STM32WB1x and STM32WB5x* wireless MCU. These two products help simplify circuit design and optimize RF transmission for the STM32WB wireless microcontroller and the Programmable Bluetooth Low Power Wireless Application Processor (BlueNRG LPx).

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2023-04-29, STMicroelectronics ultrasonic oxygen concentration sensor module scheme

Ultrasonic technology (ultrasonic time difference method) is the use of a pair of ultrasonic transducers meet each other alternately (or at the same time) to receive and receive ultrasonic waves, through the observation of ultrasonic wave in the medium (gas or liquid) in the downstream and counter-current propagation time difference to indirectly measure the flow rate of fluid, and then through the flow rate to calculate the flow rate of an indirect measurement method

Technology Cover

2023-04-29, Qorvo Biotechnologies has signed a long-term license agreement with Zomedica

Qorvo, a leading provider of RF solutions in mobile, infrastructure and aerospace and defense applications, announced the upcoming strategic restructuring of its existing development and commercialization agreement with Zomedica Corp for the TRUFORMA family of products.

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2023-04-29, Ames Osram partnered with Quadric

AMS, a leading global provider of optical solutions, and Quadric, an IP innovator in end-to-end AI machine learning processors, have announced a strategic partnership to jointly develop integrated sensing modules that combine AMS 'cutting-edge Mira family of visible and infrared CMOS sensors with Quadric's new Chimera™ GPNPU processor

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2023-04-29, ON Semiconductor delivered its billionth induction sensor IC to HELLA

Onsemi announced that it has delivered its billionth induction sensor interface integrated circuit (IC) to HELLA, an international automotive parts supplier and part of the FORVIA Group. The ON designed IC is used in HELLA's contactless Inductive Position Sensor (CIPOS®) technology for automotive drive-by-wire systems. Over 25 years of collaboration, the two companies have developed innovative designs that reduce the size of the HELLA module and ON IC to better fit applications with high dimensional requirements for modules.

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2023-04-29, Swissbit unveils new security keys

Swissbit expands the company's line of hardware security keys with the launch of the iShield Key Pro, which is not just another product that supports the FIDO standard. The new security key further adds more security standards and features, providing greater flexibility for online accounts to be more secure against password-free, authentication phishing attacks, and protection.

Technology Cover

2023-04-28, The first innovative digital packaging analog IP subsystem

Agile Analog, a customizable analog IP company, has launched its first analog subsystem family, covering power management, PVT detection, and sleep management. These innovative digital packaging subsystems allow multiple analog ips to be placed directly into the digital design process and connected via a standard peripheral bus such as AMBA APB, significantly reducing the amount of work required to integrate multiple analog ips into any ASIC. These subsystems look like an ordinary digital IP block, with the standard interfaces that engineers expect to make it easy to understand and work with.

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2023-04-28, The Mira series of visible and near-infrared image sensors is an excellent way for AI to see the world

Imis Osram's Mira family of image sensors is the perfect choice for intelligent design and future product development. The product has the advantage of high frame rate and can provide monochromatic, multi-color and even infrared data images, thereby quickly delivering high quality data and showing outstanding performance. Thanks to AI-enhanced imaging, Imis Osram's image sensors are combined with AI processors to enable greater security and performance in consumer electronics and industrial products.

Technology Cover

2023-04-28, Texas Instruments and Special Power to create a more efficient electric vehicle charging network

Ti remains committed to providing customers with innovative chip - and system-level solutions. As users' demand for charging speed and convenience continues to improve, TI works closely with its partners in DC charging devices, AC charging devices and power distribution units (PDUs) to help customers realize charging solutions with higher power and efficiency, and resolve the "endurance anxiety" of electric car owners. It is no longer a dream to charge at any time, charge as you go, and charge in an orderly manner.

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2023-04-28, Germany's Bosch has acquired America's TSI, adding to the global semiconductor business

Germany's Bosch Group said it will buy the assets of US chipmaker TSI Semiconductor to expand its semiconductor business in silicon carbide chips (SiC), foreign media reported. Bosch and TSI have reached an agreement, but did not disclose details of the acquisition, which is subject to regulatory approval.

Technology Cover

2023-04-28, Onsemi and ZEEKR Krypton have signed a long-term supply agreement for silicon carbide power devices

Onsemi and luxury smart pure electric brand Krypton Intelligent Technology (ZEEKR) announced the signing of a long-term supply agreement (LTSA). Ansamey will provide Polkrypton with EliteSiC silicon carbide (SiC) power devices to improve the energy efficiency of its smart electric vehicles (EVs), resulting in improved performance, faster charging and longer range.

Technology Cover

2023-04-28, Nexperia introduces advanced I2C GPIO extender product portfolio

Nexperia announced the launch of a new 16-channel I2C Universal Input/Output (GPIO) extender portfolio designed to improve the flexibility and reuse of electronic systems. One of the GPIO extenders, the NCA9595, has an internal pull-up resistor that can be configured via registers, which can be customized to optimize power consumption. When it is necessary to expand the amount of I/O, this product portfolio enables a clean design while minimizing interconnection.

Technology Cover

2023-04-28, Infineon unveils its new i-ToF image sensor to help create a smaller 3D camera system

Infineon Technologies and Uplander (pmd), a quality partner specializing in 3D ToF, have jointly launched the IRS2877C ToF VGA sensor, a performance advanced version of the IRS2976C Time of Flight (ToF) VGA sensor. The sensor is a new addition to the REAL3™ family of products.

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2023-04-28, New stretchable wireless bioelectronic system

The research team recently designed a wireless bioelectronic patch made from a flexible printed circuit board that can be custom-designed to monitor several physiological biomarkers for the healing process and the onset of infection, control drug delivery through electroactive hydrogels, and apply voltage through electrical stimulation to promote healing at the wound site.

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2023-04-27, New three-phase high efficiency power supply without fan conduction cooling

COSEL has announced the introduction of a 3500W AC/DC three-phase input enclosed power supply HCA3500TF for industrial equipment such as high-frequency amplifiers, laser processors and robots. Its input voltage is suitable for global, three-phase triangle or three-phase star networks, and the input voltage range is 180V to 528VAC. It has two output voltages, 48VDC and 65VDC, and can be adjusted in the positive 15% and negative 50% range using the fine tuning function.

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2023-04-27, BLDC motor Flash MCU with lithium battery charging control

For DC brushless motor control field, Holtek launched Flash MCU BD66FM5252 combined with lithium battery charging control. Brushless DC motor products used in handheld charging can save the cost of charging IC, giving the product unique competitiveness. BD66FM5252 has 8K×16 Flash ROM, 2K×8 RAM, 512×8 EEPROM and internal system frequency of 20MHz, has 11 channels 12-bit fast ADC, and configure 4 groups of PWM output/input capture function Timer.

Technology Cover

2023-04-27, LED solution to provide lighting experience for Regensburg Baseball Stadium

Ames Osram (AMS) and Musco (Musco), the world's leading provider of optical solutions, announced that Armin-Wolf-Arena, the baseball stadium in Regensburg, Germany, has adopted Masco lighting systems in collaboration with Ames Osram OSCONIQ® LED, Create a new lighting experience of the world's top sporting events.

Technology Cover

2023-04-27, STMicroelectronics has released new extension tools with full support for Microsoft Visual Studio Code

STMicroelectronics has released new extension tools that bring the benefits of Microsoft Visual Studio Code (VS Code), Microsoft's integrated development environment, to the STM32 microcontroller. VS Code is a popular integrated development environment (IDE) known for its ease of use and flexibility. IntelliSense, for example, simplifies and speeds up code editing.